Special Report
The Bumpy Road To FinFETs
New materials, new processes, different fin approaches and backend process control all add up to a difficult transition.
Top Stories
Shootout At 28nm
Companies scramble for position at established node, battling over price, performance and power.
Atomic Layer Etch Finally Emerges
After nearly two decades of being confined to R&D labs, equipment makers are placing big bets on this next-gen plasma etch technology.
How Much Testing Is Enough?
Wedged between rising complexity and an industry that refuses to increase test costs, testing equipment makers are raising important questions about what is enough test coverage.
Test Challenges Grow
Experts at the table, first of three parts: New techniques for reducing cost; limitations of existing approaches; what’s changed and future challenges.
Blogs
Editor in Chief Ed Sperling contends we are Drowning In Choices because the number of options is huge and there’s no easy way to sort through them. But they all need to be considered from the outset.
Executive Editor Mark LaPedus says chipmakers have stopped beating the 450mm drums. Is 450mm Dead In The Water?
Mentor Graphics’ David Abercrombie compares SADP to a Rorschach ink blot test in Self-Aligned Double Patterning, Part One.
Applied Materials’ Kavita Shah observes that interconnect performance and reliability are getting progressively more difficult to maintain at each successive process node in New Materials Era In Advanced Interconnects.
Patterning guru Mike Watts looks at what will replace feature shrinking after 2020 in Beyond Moore’s Law.
SEMI’s Paula Doe scopes out the changes ahead for micro-electro-mechanical systems in What’s Next For MEMS.
And Semico Research’s Adrienne Downey says there’s good reason to get excited about the 3D Printing Revolution Ahead.
