Special Report
Is EUV Making Progress?
Instead of focusing just on the light source, researchers are now pushing for breakthroughs in the photoresist. But other problems remain.
Top Stories
Foundries Expand Planar Efforts
Not everyone will move to finFETs, and even those that do won’t necessarily do it quickly. Foundries are moving quickly to capitalize on this trend.
Getting Over Overlay
Solutions are being developed, but there are questions about how effective and efficient they will be.
3 Ways To Reload Moore’s Law
A lateral shrink of transistors cannot continue indefinitely. There aren’t enough atoms.
Speeding Up E-beam Inspection
There is an urgent need for new technology in EUV mask inspection and traditional wafer inspection.
Blogs
Editor In Chief argues that from the big picture standpoint, there are side benefits to all research, in Not All Scientific Problems Can Be Solved.
Executive Editor Mark LaPedus doesn’t believe a mega-merger will occur in the fab tool sector anytime soon, in Fab Tool M&A Slowdown?
Mentor Graphics’ David Abercrombie uncorks part one on the limits of tools in finFET-based SoCs, in Case Studies In Double-Patterning Debug.
Applied Materials’ Max McDaniel contends it’s just a matter of time before we’re rolling our own devices like newspapers, in The Future Is Flexible.
SEMI’s Osamu Nakamura takes a look at how Japan’s semiconductor industry has changed, in Japan: Finding Leadership In New Technology Areas.
Semico Research’s Adrienne Downey crunches some numbers and finds total expenditures will hit $68B this year, with Samsung on top followed by Intel and TSMC, in Capex Growing To A Record High In 2015.
NuFlare’s Noriaki Nakayamada looks at past, present and future, in Conquering Heat Issues In E-Beam Lithography.
White Papers
FinFET And Multi-Patterning Aware Place And Route Implementation
A look at changes across the physical implementation flow and how to deal with them.
In-Die Registration Measurement Using Novel Model-Based Approach For Advanced Technology Masks
Multi-patterning requires tighter specification as the pattern size gets smaller on advanced devices.
