Top Stories
EUV Arrives, But More Issues Ahead
Improvement still needed for uptime, defectivity, line edge roughness and process flows.
Making Chip Packaging Simpler
Integrating heterogeneous chips is the promise of advanced packaging, but more work needs to be done to make it happen.
EUV Mask Readiness Challenges
Experts at the Table, Part 1: 250W power source appears sustainable and reliable, but defects in mask blanks, 3D mask effects and fabrication of those masks remain problematic.
Blogs
Editor In Chief Ed Sperling examines the drivers for the next wave of disruptions in chip manufacturing, in A Different Kind Of Material World.
Editor Mark LaPedus reports a wave of mergers are occurring in electronic materials amid a sea of change, in Materials M&A Mania.
Applied Materials’ Matt Cogorno and Toshihiko Miyashita explain why trimming fins after dummy gate removal reduces deformation and improves power, performance and area/cost, in Selective Removal For Stronger Fins.
SEMI contributor and IHS Markit analyst Manuel Tagliavini sees 3D optical sensing now ramping up beyond high-end smartphones, in More Devices Will See In 3D.
Semico Research’s Adrienne Downey describes the state of new fabs and wafer capacity expansion amid a slowing memory market, in Slow And Cautious Start To 2019 For Memory Manufacturers.
Sponsor White Papers
Low Ripple Notch Filter Designs Using Apodized Thickness Modulation
How to make low-ripple notch filters—a band-stop filter—by reducing side lobes with apodized process.
Generation 10+ Fabs Enable Bigger, Brighter, Better TV Displays
As TVs gets larger, fabs are increasing capacity to meet demand for popular TVs, such as the 65-inch, 8K-resolution, G10+ OLED.
