Top Stories

Defect Challenges Grow For IC Packaging
New equipment will help, but it’s expensive and requires more steps.

Much Smarter Manufacturing
How AI, ubiquitous connectivity, and sensors everywhere are reshaping manufacturing of chips, and nearly everything else.

Mask/Lithography Issues For Mature Nodes
Experts at the Table: Aging tools with no spare parts, but near-zero CapEx, are holding back purchases of new equipment.

Blogs

Executive Editor Mark LaPedus lays out a Gartner analyst’s outlook for semis, in What’s Ahead For Chips & Equipment?

Amkor’s Ajay Sattu looks at emerging trends in automotive, cloud, and 5G that are pushing new improvements in power packaging, in Power Packaging Trends And The 48V Ecosystem.

Coventor’s David Fried explains how to simulate all of the processing that occurs when real wafers are built for thorough process testing and optimization, in Winning The Global Race For Semiconductor Technology With Virtual Fabrication.

Quik-Pak’s Ken Molitor digs into why RF-optimized packaging products and processes are essential to the 5G ramp-up, in Packaging Demands For RF And Microwave.

SEMI’s Bee Bee Ng takes a tour of key technologies, challenges, and opportunities in smart manufacturing, in Smart Backend Assembly Factory For Industry 4.0.