Top Stories
DSA Re-Enters Litho Picture
Why this technology is getting a serious look at 5/3nm and beyond, and who’s driving it.
Non-Traditional Chips Gaining Steam
Flexible hybrid electronics are showing up in a variety of markets where electronics never existed before.
More Lithography/Mask Challenges
Experts at the Table, part 1: EUV ramps up, but high-volume manufacturing isn’t likely to begin until at least the end of the year, maybe later.
Blogs
Editor in Chief Ed Sperling predicts big changes ahead in semiconductor design, manufacturing and packaging, in AI: The Next Big Thing.
Executive Editor Mark LaPedus points to moves by the U.S. government to reduce dependence on vital imported materials, in Trump Wants Critical Metals.
Technical Editor Katherine Derbyshire argues that no matter how efficient they become, neuromorphic computers are fundamentally different than human brains, in How The Brain Saves Energy By Doing Less.
Lam Research’s Dennis Hausmann drills down into ALD and the use of new materials and 3D designs in advanced chip manufacturing, in How Atomic Layer Deposition Works.
Applied Materials’ Mike Rosa explains why a hybrid solution will be required for wireless communication and what that means for future chips, in Mixing 4G And 5G.
SEMI’s Clark Tseng looks at blockchain technologies and why they are driving so much foundry business, in Counting On Cryptocurrency.
GlobalFoundries’ Gary Patton contends that increasing density in chips is no longer the only path forward, in New Applications, Multiple Approaches.
Sponsor White Paper
CMOS-Embedded STT-MRAM Arrays In 2xnm Nodes For GP-MCU Applications
A look at robust STT-MRAM technology, including full array functionality with low bit-error rate.
