Top Stories
What Happened To ReRAM?
After years of delays, this next-gen memory is finally gaining traction.
Unsolved Litho Issues At 7nm
Computational challenges on the rise with EUV. Scanners are no longer interchangeable.
Challenges Mount For Photomasks
Optical proximity correction, EUV pellicles, inverse lithography and actinic inspection make it hard to achieve a return on investment at advanced nodes.
News
Node Warfare?
GlobalFoundries unveils 12nm finFET process; foundries jockey for position on way to next full node.
Blogs
Editor In Chief Ed Sperling argues that materials vendors need to be included up front in process development or the whole industry will suffer, in The Materials Gap.
Executive Editor Mark LaPedus examines the latest trends in materials, in 5 Takeaways From SEMI’s SMC.
Technical Editor Katherine Derbyshire explains why neuromorphic computing and neural networks are not the same thing, in Terminology Beyond von Neumann.
SEMI’s Christian Dieseldorff points to big sales growth in Korea and China, in Fab Equipment Spending Sets New Record.
Coventor’s Jimmy Gu digs into how to identify which process parameters drive fin top critical dimensions, in Using Advanced Statistical Analysis To Improve FinFET Transistor Performance.
Semico Research’s Adrienne Downey looks inside the market for 3D sensing technologies, in Big Push For 3D Sensing With iPhone X.
