Top Stories
Wafer Shortage Improvement In Sight For 300mm, But Not 200mm
Suppliers are investing new 300mm capacity, but it’s probably not enough. And despite burgeoning 200mm demand, only Okmetic and new players in China are adding capacity.
Shortages Spark Novel Component Lifecycle Solutions
Fabs and equipment vendors are optimizing components in ways that previously were considered unnecessary.
Driving Toward More Rugged, Less Expensive SiC
Silicon carbide is gaining ground, but complex processes and high defectivity are limiting its appeal.
Video
Deep Learning In Industrial Inspection
Using deep learning to find defects.
Blogs
Coventor’s Gerold Schröpfer draws on ideas from the early days of computing to reduce power consumption, in There Is Plenty Of Room At The Top: Imagining Miniaturized Electro-Mechanical Switches In Low-Power Computing Applications.
Amkor’s Prasad Dhond looks at why reducing defects becomes more important as the number of chips in cars continues to accelerate, in The Drive Toward Zero Defects.
eBeam Initiative’s Jan Willis presents a discussion with Micron’s Mike Hermes about major photomask technology changes and the challenges EUV poses for the mask shop, in The Changing Mask Landscape.
Lam Research’s David Haynes finds that 5G is not the only wireless revolution taking place, in Our Wireless World: How Wi-Fi 6 Will Seamlessly Integrate With 5G To Help Keep Us Connected.
Brewer Science’s Jessica Albright explains the importance of monitoring and reporting different classes of emissions, in Reducing Greenhouse Gases In Manufacturing.
SEMI’s Serena Brischetto previews an upcoming keynote from Imec’s Luc Van den hove, who suggests looking beyond PPA to take a device’s environmental footprint into account, in Deep Tech Drives Semiconductor Sustainability.
Sponsor White Papers
A Guide To Fast Optimal Solutions To Complex Problems For Quantum Computers
What quantum computers are, and why they are attracting so much interest.
Wafer Level Void-Free Molded Underfill For High-Density Fan-Out Packages
Experiments and mold flow simulation results for a void-free wafer level molded underfill process with High-Density Fan-Out test vehicles using a wafer-level compression molding process.
Study Of Bondable Laser Release Material Using 355nm Energy To Facilitate RDL-First And Die-First Fan-Out Wafer-Level Packaging (FOWLP)
Finding the right bondable laser release material that eliminates die attach material from the process flow.
