Top Stories

Demand, Lead Times Soar For 300mm Equipment
Capacity demand at the leading edge is creating a supply shortage for key manufacturing equipment.

Advanced Packaging’s Next Wave
A long list of options is propelling multi-chip packages to the forefront of design, while creating a dizzying number of options and tradeoffs

Automotive IC Shortage Drags On
Long lead times expected at least through the end of this year, as chipmakers scramble for solutions.

Blogs

Executive Editor Mark LaPedus questions how long the party will last, in Flat-Panel Display Demand Soars.

Amkor’s Prasad Dhond explains how a shortage of wire bonders and substrates has an impact much further down the supply chain, in Automotive Chip Shortages: An Assembly Perspective.

SEMI’s Inna Skvortsova shines a light on how new technologies that require more processing steps are resulting in higher wafer fabrication and packaging materials consumption, in Robust Growth And Strong Outlook For Semiconductor Materials.

Lam Research’s Krishnan Shrinivasan examines the impact of faster wireless on everyday applications, in Potential For 5G In Daily Life.

QP Technologies’ Rosie Medina shows how one company addressed the challenges posed by COVID-19, in Rethinking Business As Usual.

Sponsor White Papers

Improvement Of EUV Si Hardmask Performance Through Wet Chemistry Functionalization
A novel approach to functionalize spin-on silicon hardmasks by hybridizing them with functional groups through a sol-gel approach.

Adding Value With Unit Level Traceability (ULT) In Automotive Packaging
Minimizing automotive recalls with product traceability.