Top Stories
193i Lithography Takes Center Stage…Again
High-NA EUV is still in the works, but more chips/chiplets will be developed using older, less-expensive equipment.
Smart Manufacturing Makes Gains In Chip Industry
Lights-out manufacturing is increasingly sought and used by fabs and OSATs.
Will CFETs Help The Industry Go Vertical?
Stacking of nMOS on top of pMOS devices is possible using monolithic or sequential flows. Each has its pros and cons.
Balancing AI And Engineering Expertise In The Fab
Results show big improvements when both are deployed for new process development.
Preparing For 5G Millimeter Wave And 6G
The technology challenges are daunting, the unknowns plentiful, and they span entire ecosystems.
Blogs
Editor in Chief Ed Sperling digs into why geopolitics and technology shifts could drive a new supply and demand imbalance, in The Next Chip Shortages?
Amkor’s WonChul Do looks at a dual damascene process with an organic dielectric that overcomes challenges of defining fine trace lines, in High-Density Fan-Out Packaging With Fine Pitch Embedded Trace RDL.
Coventor’s Taeyon (TY) Oh shows how determining optimal fin height and curvature can increase channel length, prevent short channel effects, and boost data retention times, in Improving DRAM Device Performance Through Saddle Fin Process Optimization.
Brewer Science’s Jessica Albright lays out nine criteria essential for a successful bonding process, in A Technical Guide To Selecting A Photosensitive Permanent Bonding Material.
SEMI’s Heidi Hoffman marvels at autonomous human-like soft robots that have applications in fields such as healthcare, education, and space and ocean exploration, in A New Class Of Actuators Mimicking Human Muscle.
Sponsor White Papers
Risks And Faults We Can Detect Using Machine Learning And Physics
Condition monitoring has grown up.
Enhancing Punch MLF Packaging With Edge Protection Technology
Resolving the issue of package cracks/gaps on MLF/QFN packaging.
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