Top Stories
Improving Redistribution Layers For Fan-Out Packages And SiPs
Good adhesion, stress management, and warpage control are features of high performing RDLs.
How To Compare Chips
Traditional metrics no longer work in the context of domain-specific designs and rising complexity.
The High Price Of Smaller Features
In a high-NA exposure stack, the resist is just the beginning.
Blogs
Amkor’s Nathan Whitchurch looks at the unique challenges of complex packages and why they require high simulation fidelity to characterize performance, in Thermal Simulation Of DSMBGA And Coupled Thermal-Mechanical Simulation Of Large Body HDFO.
SEMI’s Serena Brischetto interviews TEL’s Eyal Shekel about how materials informatics enabled by AI can guide optimization of production processes, in Smart Manufacturing And Advanced Technical Service.
Coventor’s Yu De Chen investigates the impact of LER on metal line resistance through variation experiments, in How Does Line Edge Roughness (LER) Affect Semiconductor Performance At Advanced Nodes?
Sponsor White Papers
A Study Of The Impact Of Line Edge Roughness On Metal Line Resistance Using Virtual Fabrication
The impact of LER on metal line resistance by varying metal line CDs and metal line materials during process modeling split experiments.
Next-Generation Chip Embedding Technology For High-Efficiency Power Modules And Power
Details of an embedded substrate process and package that uses the die‐first process sequence.
Services Beyond Packaging, Summer 2022 Newsletter
The latest from QP Technologies, focusing on wafer prep, IC assembly and other services beyond packaging.
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