Services Beyond Packaging, Summer 2022 Newsletter

The latest from QP Technologies, focusing on wafer prep, IC assembly and other services beyond packaging.


Technology Focus: Services

Services Beyond Packaging: QP Technologies is known for offering a wide range of package types. We also provide a variety of semiconductor manufacturing services to meet your packaging and assembly requirements. These include wafer preparation (backgrinding, dicing, die sort and inspection), IC assembly processes for a variety of package types and materials, laser micromachining, and design and engineering services.

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