Chip Industry Week in Review


Lines are blurring between government and industry: On the heels of last week's resignation demand, Intel CEO Lip-Bu Tan met with President Trump on Monday, with the President later saying, "The meeting was a very interesting one. His success and rise is an amazing story."  Now, Bloomberg reports the Trump administration is in talks with Intel for the U.S. government to take a stake in th... » read more

Big Changes In Medical Electronics


Medical devices are becoming more capable, more complicated, and more deployable in the field rather than in a hospital or a doctor's office. But getting these purpose-built devices into the hands of consumers requires a whole bunch of new challenges, from safeguarding fragile on-board chemistries that can be destroyed by existing chip manufacturing and packaging processes to ensuring the mater... » read more

Chip Industry Week in Review


Check out the Inside Chips podcast for our behind-the-scenes analysis of changes at Intel Foundry. Intel rolled out its updated process technology roadmap this week, along with early process design kit (PDK) for its 14A gate-all-around process technology. That node will utilize high-NA EUV, and include direct contact power delivery, the second generation of its backside power delivery techno... » read more

What’s Next In Advanced Packaging?


Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC progress and issues, photonics, and tradeoffs with different interposers and bridge technologies, with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director at Synopsys Photonics Solutions. What fo... » read more

Advanced Packaging Moving At Breakneck Pace


Experts at the Table: Semiconductor Engineering sat down to discuss advances in packaging with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director at Synopsys Photonics Solutions. What follows are excerpts of that discussion. [Part 2 of the discussion is here.] ... » read more

Electrifying Everything: Power Moves Toward ICs


As electronic systems grow increasingly complex and energy-intensive, traditional power management methods — centered on centralized systems and external components — are proving inadequate. The next wave of innovation is to bring power control closer to the action — directly on the chip or into a heterogeneous package. This change is driven by a relentless pursuit of efficiency, scala... » read more

Advancing Medical Devices Through Heterogeneous Integration


As medical treatments continue to evolve, innovation in medical devices plays a vital role, enabling increasingly complex, precise, and safer interventions. For example: Endoscopic devices provide high-resolution in vivo imaging, Wearable sensors offer real-time monitoring of vital signs, Implantable devices engage with the human body at the cellular level. These devices’ ongo... » read more

Heterogenous Integration Expertise for Sensors and MEMS Packaging and Assembly


Sensors and microelectromechanical systems (MEMS) are unlocking new design possibilities for miniature devices used in healthcare, smart systems, consumer electronics, and more. Designers need a partner experienced with Heterogenous Integration (HI) to assemble the unique components for these devices and address the complications of these integrations. In this white paper, you will learn: ... » read more

Navigating Increased Complexity In Advanced Packaging


As chips evolve toward stacked, heterogeneous assemblies and adopt more complex materials, engineers are grappling with new and often less predictable sources of variation. This is redefining what it means to achieve precision, forcing companies to rethink everything from process control and in-line metrology to materials selection and multi-level testing. These assemblies are the result of ... » read more

Advanced Packaging Drives Test And Metrology Innovations


Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased transistor density and better performance. But the pace of change is accelerating, making it harder for the entire ecosystem to keep up with those changes. In the past, major developments were roughly on an 18-month to 2-year cadence. Today, this is happening every few mon... » read more

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