tag: Promex Industries

Emerging Technologies Driving Heterogeneous Integration
By Ed Sperling - 24 Sep, 2024 - Comments: 0

As chips are disaggregated into chiplets, more features are being added into these devices that chipmakers were unable to include in the past due to reticle size limits and the high cost of scaling everything to the latest process node. This has opened the door to new architectures, new materials such as glass substrates, and a variety of new challenges. Dick Otte, president and CEO of Promex I... » read more

How Die Dimensions Challenge Assembly Processes
By Anne Meixner - 19 Sep, 2024 - Comments: 1

Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. To fully enable a multi-chiplet ecosystem, standardized component handling and interfaces are needed. The underlying concept is similar to LEGO blocks that simply snap together, yet it's nowhere near t... » read more

Managing EMI in High-Density Integration
By Gregory Haley - 19 Sep, 2024 - Comments: 0

The relentless drive for higher performance and increased functional integration has ushered in new challenges for managing electromagnetic interference (EMI) in densely packed mixed-signal environments. Integrating analog, RF, and digital circuits into a single system-on-chip (SoC) or advanced package requires solutions that reduce system size and improve performance. However, this tight in... » read more

3.5D: The Great Compromise
By Ed Sperling - 21 Aug, 2024 - Comments: 1

The semiconductor industry is converging on 3.5D as the next best option in advanced packaging, a hybrid approach that includes stacking logic chiplets and bonding them separately to a substrate shared by other components. This assembly model satisfies the need for big increases in performance while sidestepping some of the thorniest issues in heterogeneous integration. It establishes a midd... » read more

Why Small Fab And Assembly Houses Are Thriving
By Bryon Moyer - 15 Aug, 2024 - Comments: 0

High-volume products get more than their fair share of attention in the semiconductor world, but most chips don't fit into that category. While a few huge fabs and offshore assembly and test (OSAT) houses process enormous volumes of chips, small fabs and packaging lines serve for lower volumes, specialized technology, and prototyping. “There are companies that run literally one lot of 25 w... » read more

Precision Patterning Options Emerge For Advanced Packaging
By Gregory Haley - 23 Jul, 2024 - Comments: 0

The chip industry is ratcheting up investments in advanced packaging as it strives to keep pace with demands for increased functionality and higher performance, including novel patterning technologies that can reduce costs and speed time to market. Success in advanced packages is partly dependent on effectively managing the interconnectivity between the chips, which requires increasingly pre... » read more

Controlling Warpage In Advanced Packages
By Laura Peters - 24 Jun, 2024 - Comments: 1

Warpage is becoming a serious concern in advanced packaging, where a heterogeneous mix of materials can cause uneven stress points during assembly and packaging, and under real workloads in the field. Warpage plays a critical role in determining whether an advanced package can be assembled successfully and meet long-term reliability targets. New advances, such as molding compounds with impro... » read more

What Works Best For Chiplets
By Anne Meixner - 18 Apr, 2024 - Comments: 0

The semiconductor industry is preparing for the migration from proprietary chiplet-based systems to a more open chiplet ecosystem, in which chiplets fabricated by different companies of various technologies and device nodes can be integrated in a single package with acceptable yield. To make this work as expected, the chip industry will have to solve a variety of well-documented technical an... » read more

Silicon Photonics Manufacturing Ramps Up
By Gregory Haley - 21 Mar, 2024 - Comments: 0

Circuit scaling is starting to hit a wall as the laws of physics clash with exponential increases in the volume of data, forcing chipmakers to take a much closer look at silicon photonics as a way of moving data from where it is collected to where it is processed and stored. The laws of physics are immutable. Put simply, there are limits to how fast an electron can travel through copper. The... » read more

Navigating Heat In Advanced Packaging
By Gregory Haley - 18 Jan, 2024 - Comments: 0

The integration of multiple heterogeneous dies in a package is pivotal for extending Moore’s Law and enhancing performance, power efficiency, and functionality, but it also is raising significant issues over how to manage the thermal load. Advanced packaging provides a way to pack more features and functions into a device, increasingly by stacking various components vertically rather than ... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy