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Services Beyond Packaging, Summer 2022 Newsletter


Technology Focus: Services Services Beyond Packaging: QP Technologies is known for offering a wide range of package types. We also provide a variety of semiconductor manufacturing services to meet your packaging and assembly requirements. These include wafer preparation (backgrinding, dicing, die sort and inspection), IC assembly processes for a variety of package types and materials, laser ... » read more

Hunting For Macro Defects: The Importance Of Bare Wafer Inspection


As logic and memory semiconductor devices approach the limits of Moore’s Law, the requirements for accuracy in layer transfer become increasingly stringent. One leading silicon wafer manufacturer estimates that 50% of epitaxial wafer supply for logic will be on nodes equal to or less than 7nm. This is up approximately 30% from earlier in the decade. To meet the demands of extreme ultraviol... » read more

Surfscan SP3/Ax Unpatterned Wafer Inspection Systems


Unpatterned wafer inspection systems are used for process qualification, tool qualification, tool monitoring, outgoing wafer quality control, incoming wafer quality control, and process debug. Learn more about a system from KLA that identify defects and wafer surface quality issues that affect the performance and reliability of chips manufactured for the automotive, IoT, 5G, consumer electronic... » read more

Compound Semiconductor Innovation Advances EVs And Other Green Technologies


As the world works to reduce greenhouse gas emissions, global adoption of electric vehicles (EVs) is driving an increased demand for high-power, energy-efficient compound semiconductors, such as silicon carbide (SiC)-based components, throughout the entire EV assembly process. Renewable energy technology is now at the forefront of climate-forward research, with accelerating EV sales playing... » read more

Strategies For Meeting Stringent Standards For Automotive ICs


It may surprise you, but when it comes to chips in electronic braking systems, airbag control units, and more, automotive manufacturers are still using 10-year-old technology — and with good reason. For the automotive industry, the reliability, stability, and robustness of electronic components are critical, especially when it comes to meeting the stringent Automotive Electronics Council (... » read more

Better Inspection, Higher Yield


Wafers can be inspected for large, obvious defects, or for small, subtle ones. The former is referred to as macro-inspection, while the latter is micro-inspection. These processes use different machines with different capital and operating costs, and they might look like competing approaches with different economic returns. In fact, they are complementary tactics that can be balanced within an ... » read more

Defect Image Classification And Detection With Deep Learning


Authors: Dan Sebban and Nissim Matatov Inspection means have increasingly been incorporated into typical manufacturing of boards, substrates and/or systems. A significant number of automatic inspections rely on the analysis of images that are acquired by a multitude of means such as optical, X-ray, infrared, acoustic microscopy. In contrast to automatic inspections, traditional visual inspec... » read more

Inspecting Unpatterned Wafers


Unpatterned wafer inspection, which has flown well under the radar for most of the semiconductor industry, is becoming more critical amid the need to find defects earlier in the manufacturing process flow. Finding those defects is getting harder as critical dimensions shrink. It's more difficult to actually detect smaller defects on bare wafers, there is more data to process, and there is mo... » read more

The Challenges Of Process Control On FinFETs And FD-SOI


Across the semiconductor industry, both FD-SOI and finFET transistor technologies are in high volume production, with IC manufacturers looking to extend both technologies to gain additional performance improvements and meet the variety of customer specific technical and economic requirements. In developing the processes needed for the next-generation FD-SOI and finFET technologies, both transis... » read more

Understanding Process And Design Systematics


As design rules shrink, semiconductor manufacturing becomes more complex which leads to a huge increase in the defects which could cause a non-yielding die. Process control and inline defect analysis becomes widely relevant to help shorten the learning process from R&D to production. This paper discusses the various methodologies which leverage patterned wafer inspection tools to help analyze d... » read more

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