Big Shifts In Power Electronics Packaging


The power semiconductor market is poised for remarkable growth in the next several years, fueled by the adoption of electric vehicles and renewable energy, but it also driving big changes in the packaging needed to protect and connect these devices. Packaging is playing an increasingly critical role in the transition to higher power densities, enabling more efficient power supplies, power deli... » read more

Panel Tackles Chiplet Packaging Challenges


QP Technologies recently exhibited at the first Chiplet Summit, held January 24-26 in San Jose, California. Dick Otte, CEO of our parent company Promex Industries, participated on a panel titled “Best Packaging for Chiplets Today.” Moderated by Nobuki Islam with JCET Group, the packaging panel also included Daniel Lambalot, Alphawave Semi; Laura Mirkarimi, Adeia; Syrus Ziai, Eliyan; and Mik... » read more

Unknowns And Challenges In Advanced Packaging


Dick Otte, CEO of Promex Industries, sat down with Semiconductor Engineering to talk about unknowns in material properties, the impact on bonding, and why environmental factors are so important in complex heterogeneous packages. What follows are excerpts of that conversation. SE: Companies have been designing heterogeneous chips to take advantage of specific applications or use cases, but th... » read more

The Path To Known Good Interconnects


Chiplets and heterogenous integration (HI) provide a compelling way to continue delivering improvements in performance, power, area, and cost (PPAC) as Moore’s Law slows, but choosing the best way to connect these devices so they behave in consistent and predictable ways is becoming a challenge as the number of options continues to grow. More possibilities also bring more potential interac... » read more

Heterogeneous Integration: Fertile Ground For Medical And Biotech Innovation


Sensing components in medical and biotech devices often place severe restrictions on the assembly methods that can be employed, which is part of what is driving heightened demand for heterogeneous integration (HI). It is the newest frontier for the medical and biotech manufacturing services industry to contribute our own innovations by developing the processes to build these unique combinations... » read more

Heterogeneous Integration Issues And Developments


There are a slew of new developments in advanced packaging, from new materials, chiplets, and interconnect schemes, to challenges involving how to physically put chips in a package, metallization, thermal cycling, and parasitics in the interconnect path. Dick Otte, CEO of Promex Industries, talks about how this will change chip design and manufacturing, and how those changes are likely to unfol... » read more

Hot Trends In Semiconductor Thermal Management


Increasing thermal challenges, as the industry moves into 3D packaging and continues to scale digital logic, are pushing the limits of R&D. The basic physics of having too much heat trapped in too small a space is leading to tangible problems, like consumer products that are too hot to hold. Far worse, however, is the loss of power and reliability, as overheated DRAM has to continually r... » read more

Heterogeneous Chip Assembly Helps Optimize Medical And Wearable Devices


Heterogeneous integration (HI) has significant implications for the medical, health, and wearables industry. At Promex, we utilize a variety of complex assembly processes to achieve HI for medical and biotech applications. This post will take a closer look at the processes associated with assembling these classes of devices. Figure 1 provides a high-level overview of our approach. Nearly eve... » read more

Heterogeneous Assembly


Medical and biotech devices often include optical, chemical, RF, and liquid elements. Some are combined with electronic devices to increase functionality or interaction with the environment. To produce these devices, multiple technologies are combined in a cost-effective way, ideally using a rapid process development cycle to minimize time to market. Combining technologies, as well as combining... » read more

Week In Review: Semiconductor Manufacturing, Test


Fallout from the new U.S. export controls continues. Under new regulations, companies looking to supply Chinese chipmakers with advanced manufacturing equipment (<14nm) must first obtain a license from the U.S. Department of Commerce. In addition, U.S. persons (citizens and permanent residents) are barred from supporting China’s advanced chip development or production without a license. ... » read more

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