Special Report
Where All The Semiconductor Investments Are Going
More than $500B in new investments by nearly 50 companies; what’s behind the expansion frenzy, why now, and challenges ahead.
Top Stories
Challenges In Backside Power Delivery
BPD boosts performance, but requires wafer bonding, substrate thinning, and possibly new interconnect metals.
Hot Trends In Semiconductor Thermal Management
Cooler bonding, microfluidics, and engineered TIMs help get the heat out.
Making Chips Yield Faster At Leading-Edge Nodes
Using plasma simulation to reduce variation and defectivity during wafer manufacturing.
Blogs
Amkor’s Prasad Dhond explains why copper is superior to gold in automotive applications, in The Rise Of Copper Wires In Automotive ICs.
Calibra’s Jan Willis looks at the impact of EUV on mask spend, increasing use of pellicles, and whether circular masks are on the horizon, in High-NA EUV Complicates EUV Photomask Future.
Lam Research’s Sumant Sarkar investigates how etch depth and other etch process parameters affect parasitic capacitance, in Creating Airgaps To Reduce Parasitic Capacitance In FEOL.
Promex’s Dick Otte shows how to incorporate parts that have unique chemistries, optical characteristics, or specialized requirements into biotech devices, in Heterogeneous Chip Assembly Helps Optimize Medical And Wearable Devices.
The Electronic System Design Alliance’s Bob Smith examines the impact of hardware-assisted verification and the growth of semiconductor R&D spending on EDA fortunes, in Wall Street View Of EDA Industry.
Sponsor White Papers
Multiexpert Adversarial Regularization For Robust And Data-Efficient Deep Supervised Learning
A deep learning approach with limited computational overhead is proposed to improve the generalization and robustness of deep supervised learning models.
Heterodgeneous Assembly
Combining technologies requires a sophisticated manufacturing process known as heterogeneous assembly.
Metrology Of Thin Resist For High NA EUVL
Despite the impact of thinning resist materials, it is possible to find appropriate settings to strengthen the metrology quality output.
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