Top Stories
RISC-V Heralds New Era Of Cooperation
Collective risk taking and pooling of knowledge are only possible with a framework for collaboration. But will it continue?
AI For Data Management
The quantity and sources of data remain challenging, but new approaches are being developed to deal with it.
Trouble Ahead For IC Verification
First-time silicon success rates are falling. Survey numbers point to problem areas, but they may be missing the biggest issues.
Can Models Created With AI Be Trusted?
Evaluating the true cost and benefit of AI can be difficult, especially within the semiconductor industry.
Communication Is Key To Finding And Fixing Bugs In ICs
AI will be increasingly needed to make sense of huge amounts of data, allowing teams to work more effectively.
Chip Design Digs Deeper Into AI
Collaborations are going wider and further with multi-chiplet designs.
Why IC Design Safety Nets Have Limits
Debugging tools have their uses, but the key to better designs is the designer’s mindset.
Video
Electromigration And IR Drop At Advanced Nodes
How to achieve a DRC-clean, manufacturing-ready design at advanced nodes.
Blogs
Technology Editor Brian Bailey casts doubt on the notion that EDA has a closed mindset and is playing catchup to disruptive technologies, in DAC Panel Could Spark Fireworks.
Expedera’s Ben Gomes digs into LLMs and their importance to the vision domain due to their flexibility in handling different inputs and their strength at interpreting meaning in images, in Vision Is Why LLMs Matter On The Edge.
Arteris’ John Min outlines a way to maximize performance in lower-cost, earlier generation, mid-range processor and accelerator cores, in Turbocharging Cost-Conscious SoCs With Cache.
Siemens EDA’s Terry Meeks shows how to find and fix soft connectivity issues between diffusion layers and well regions, in Ensuring Your Power And Ground Nets Are Correctly Connected.
Cadence’s Reela Samuel shows how machine learning algorithms can pave an efficient path through design complexities, in AI-Powered Data Analytics To Revolutionize The Semiconductor Industry.
Keysight’s Allison Freedman talks about the crucial role of testing in ensuring the seamless integration of satellite services into cellular networks, in Embracing The Future: 5G NTN – Satellite Service For The Masses.
Synopsys’ Rob van Blommestein explains how AI tools can reduce design turn-around time, improve power consumption, and minimize timing requirement violations, in AI Accelerated Migration Of Existing Designs To New Processors.
Sponsor White Papers
A Unified Solution For End-To-End Low Power Verification
Verification closure for low power designs.
Will Chiplet Adoption Mimic IP Adoption?
Predicting the chiplet adoption timeframe and key enablers.
Distribution Of Currents In Via Arrays
Addressing the challenge of distributing current around a printed circuit board.
Considerations To Successfully Integrate Chiplets In Designs
Benefits, challenges, and solutions for chiplet integration.
Integrated, Turnkey Droop Response System: Heterogeneous IP Use Case
Localized droop detection and response for heterogeneous SoCs.
Steady And Unsteady Full-Engine Simulations
Power of fully coupled steady and unsteady full-engine simulations.
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