Special Report
Foundries Versus OSATs
As the industry migrates to 2.5D and 3D, a turf war is brewing.
Top Stories
IP Integration Challenges Rising
Need for more support from IP providers grows with complexity.
EDA’s Hedge Plays
Torn between more complexity and business at older nodes, the industry is subtly changing course.
New Winners And Losers
After Moore’s Law: Dwindling economic benefits will change the landscape for semiconductor, design and EDA companies.
High-Level Gaps Emerge
Experts at the Table, part one: Where the holes are showing up in tools and flows for advanced designs. Not all vendors or tools play nicely together, and no one really knows what’s going to happen with finFETs.
Reversing Course, With A Twist
Reworking older nodes may provide a big boost for tools, while opening doors for investments in other areas.
Blogs
Editor in Chief Ed Sperling observes the focus on existing process technologies will have big impacts on SoC design without big cost increases in Improving The PPA Equation.
Open-Silicon’s Jeff Scott points to the benefits of fully functional virtual prototypes of complex multicore SoCs in Software Design Moves Virtual Prototyping Into The Mainstream.
eSilicon’s Mike Gianfagna notes that all the work that’s been done in getting ready for stacked die could pay big dividends soon in 2.5/3D IC – Do We Have Liftoff?
Synapse’s Satish Bgalkotkar contends that the industry needs to take a step back and think about where we’re heading in Resurrecting The Semiconductor Industry.
Synopsys’ Tom de Schutter finds analogies on his road trip through Yellowstone National Park to virtual prototyping in Planning For The Unexpected.
Cadence’s Frank Schirrmeister finds engineering teams are using a continuum of development engines in The Agony Of Hardware-Assisted Development Choices.
Technology Editor Brian Bailey discovers a neglected patent that merged East and West in Solving A Problem In Reverse.
