Special Report
Manufacturing Constraint Fears Grow
The race to get designs done on schedule doesn’t guarantee they’ll hit market windows.
Top Stories
Industry Scorecard For 2014
First of two parts: It’s easy to make predictions, but the best in the industry have a track record of getting things spot on. How well did those 2014 predictions turn out and who was closest to the mark?
Trouble Spots And Optimism For 2015
A survey of top execs points to a solid upcoming year, but significant changes are underway as the industry grapples with thorny business and technology issues.
Is The Stacked Die Ecosystem Stagnating?
First of two parts: By most accounts, the stacked die ecosystem is status quo, with not much happening in the past year.
Software-Driven Verification
Experts at the table, part 1: What is software-driven verification and how does it relate to constrained random generation and UVM?
Blogs
Editor In Chief Ed Sperling examines what’s changing and where the possible trouble spots will be next year and beyond, in Market Outlook For 2015.
Technology Editor Brian Bailey looks back on Semiconductor Engineering’s first year and top 10 most popular stories of the year, in And The Winner Is…
Arteris’ Kurt Shuler provides a gift to anyone working with functional safety standards—a glossary of terms—in The ABCs Of ISO 26262.
Open-Silicon’s Kalpesh Sanghvi walks through the various design phases and how they can contribute to costs, in From Specification To Chip: A Holistic Design Approach.
Cadence’s Frank Schirrmeister explains why UML-based scenarios are so important for SoC-level verification, in Top-Down SoC Verification.
Synopsys’ Tom De Schutter finds that the impact drought and flood can be minimized with proper planning and perspective, in Turning On The Virtual Prototyping Hose.
eSilicon’s Mike Gianfagna points to new tools that have been lit up for the holidays, in More Online Technology.
