Special Report
AI’s Impact On Engineering Jobs May Be Different Than Expected
Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may be vital in that transition.
Top Stories
Does Your RISC-V Core Meet The Standard?
Verifying an extensible processor is more than a one-step process, especially when software compatibility is important.
Multi-Die Assemblies Require More Detailed Test Plan Earlier
Understanding connectivity issues and interactions are only part of the problem; ECOs can cause unexpected problems in other areas.
Video
Software-Defined Systems
Advantages and pitfalls for developing hardware using high-level software languages.
Challenges In Moving Data In Chips
How to ensure the right data arrives at a shared memory at the right time.
Opinion
The Verification Conundrum
When is verification finished, and how much effort was wasted in getting to that point?
Sponsor Blogs
Keysight’s Niels Faché looks at the factors reshaping how teams work and the tools they use, including AI integration and chiplet ecosystem maturation, in How The EDA Industry Will Evolve In 2026.
Siemens EDA’s Todd Burkholder and Per Viklund dig into system technology co-optimization, advocating a process where IC partitioning information is forwarded to package prototyping at an early stage, in Opening The Door To STCO: Hierarchical Device Planning.
Arteris’ André Bonnardot brings together tightly coordinated data movement and low-latency on-chip storage for real-time environments, in Solving Real-World AI Bottlenecks.
Synopsys’ Krishna Balachandran explains how to build a layered defense model that ensures data remains protected even if physical access is gained, in Building Trust At The Silicon Level: Secure Storage Solution For OTP IP.
Cadence’s Nayan Gaywala shows how to reduce energy and area costs while meeting performance requirements for RISC-V designs, in Heterogeneous Multicore System IP.
Sponsor White Papers
The Next-Generation Of Circuit Simulation In RF EDA
Programmatic control, AI integration, and automated workflows for high-frequency design.
New Innovative Way To Functionally Verify Heterogeneous 2D/3D Package Connectivity
Functional verification of multi-chiplet packages connectivity.
Will It Blend: A Methodology For Verifying The Hardware/Software Interface In Complex SoCs
Integration technologies to unify design and verification.
Automated High-Speed Interface Routing In Multi-Die Designs
How to improve efficiency, signal integrity, and scalability with an automated routing solution for high-speed die-to-die interconnects in multi-die designs.
Voice Is The New UI
With the advancement in AI networks and low-power inference devices, such as DSPs and NPUs, the time is right for voice-based user interfaces.
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