Top Stories
Using Manufacturing Data To Boost Reliability
Correlation becomes big challenge as data sources and volume increase.
Speeding Up Scan-Based Volume Diagnosis
Where the bottlenecks are, and what can be done to eliminate them.
Big Payback For Combining Different Types Of Fab Data
But technical, physical, and business barriers remain for fully leveraging this data.
Blogs
Onto Innovation’s Johnny Dai describes the benefits of using picosecond ultrasonics for RF process monitoring, in The 5G Rollout: Solving Advanced RF Metrology Challenges.
CyberOptics’ Charlie Zhu looks at how to overcome variability in the appearance of corner fill, in Deep Learning Delivers Fast, Accurate Solutions For Object Detection In The Automated Optical Inspection Of Electronic Assemblies.
Synopsys’ Tomer Morad demonstrates how to monitor system metrics and tune key parameters for optimal performance, in Optimizing System Performance At Runtime.
Advantest’s Dave Armstrong and Altanova’s Don Thompson examine why requirements for high-speed I/O test are becoming daunting, in HSIO Loopback Turns Challenges Into Opportunities For Test At 112 Gbps.
Siemens EDA’s Geir Eide points to reductions in test time with bus-based packetized test delivery, in Success Stories For Packetized Scan Data.
KLA’s Ben Tsai explores the motivations and challenges for engineers and students across five key regions, in Engineers’ Experiences Around The World.
Sponsor White Papers
Streaming Scan Network: An Efficient Packetized Data Network For Testing Of Complex SoCs
Bus-based packetized test delivery wins kudos from users.
Case Study — Deep Learning For Corner Fill Inspection And Metrology On Integrated Circuits
How deep learning was used to accurately inspect the corner fill on integrated circuits.
Extremely Large Exposure Field With Fine Resolution Lithography Technology To Enable Next-Generation Panel-Level Advanced Packaging
An extremely large exposure field with fine resolution technology on a 515 mm x 510 mm panel is demonstrated — a new technology that will address the challenges of large package size processes.
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