Special Report
The MCU Dilemma
Microcontroller vendors are breaking out of the box that has constrained them for years. Will new memory types and RISC-V enable the next round of changes?
Top Stories
Reducing Power At RTL
Dependencies, different methodologies, and a growing number of variables make this an increasingly challenging and complex problem.
Brighter Future For Photonics
Will progress in 3D stacking translate into increased opportunities for photonics chips? Progress still has to be made in several areas.
Blogs
Editor In Chief Ed Sperling points to what’s needed to add more efficiency into complex systems, in Thinking About AI Power In Parallel.
Fraunhofer’s Dirk Mayer and Olaf Enge-Rosenblatt offer some perspective on integrating hardware and algorithms, in Artificial Intelligence For Industrial Applications.
Rambus’ Niall Sorensen and Malini Narayanammoorthi describe how an IP vendor can help integrate SerDes IP in an ASIC design project and subsequent production ramp up, in Enabling Integration Success Using High-Speed SerDes IP.
Synopsys’ Ron Lowman takes a tour of what edge computing is and how AI will make edge computing and its hybrids pervasive, in How AI In Edge Computing Drives 5G And The IoT.
Mentor’s Flint Yoder details how performing topological analysis on the schematic netlist quickly identifies latch-up sensitive scenarios, in Earlier Is Better In Latch-Up Detection.
Cadence’s Paul McLellan weaves chiplets, packaging and some interesting new challenges together, in Moore And More.
Moortec’s Stephen Crosher explains why chip designers need more data to hear what chips are saying in real time, in The Future Of Embedded Monitoring.
Arm’s Chris Bergey reports that Cloud AI won’t cope with the coming device data deluge on its own. And that is where the AI Edge comes in, in AI: A Perfect Solution But At What Cost?
