Special Report
Stacked Die Are Coming Soon. Really.
After years of imminent predictions, economics finally are pointing toward vertical packaging.
Top Stories
After Moore’s Law: More With Less
There are so many new twists and opportunities that the industry may not miss the waning influence of shrinking features every couple years.
Raising The Abstraction Of Power: Trends
With design requirements of today’s SoCs going beyond performance and area, there are a number of trends where power is concerned.
IP And FinFETs At Advanced Nodes
Power emerges as the primary driver to shrink features; heat and electromigration emerge as critical issues; integration becomes an enormous challenge.
Supporting LP In New Process Nodes
Nodes and tools, while making great strides, are not always utilized at the same pace in all situations.
28nm FinFETs?
Many companies will stay at the 28nm node for an extended period of time, but will they ultimately add finFETs to reduce current leakage.
Blogs
Editor in Chief Ed Sperling observes the semiconductor industry is racing ahead, but not in any single direction, in Confusion Does Not Equal Paralysis.
Executive Editor Ann Mutschler questions whether more education is needed for widespread adoption of solar in Solar State Of Mind.
Cadence’s Brian Fuller notes that application-specific designs are just the beginning in Amazon Fire And The Importance Of Interface Design.
Ansys-Apache’s Aveek Sarkar explains why electromigration and ESD become much bigger challenges with 3D transistors in FinFET Based Designs: Reliability Verification Implications.
Synopsys’ Rita Horner contends design teams must implement PCIe solutions that meet both active and low idle power requirements in Using PCI Express L1 Sub-states To Minimize Power Consumption In Advanced Process Nodes.
Rambus’ Loren Shalinsky zeroes in on a discrepancy between semiconductor and DRAM shipments in Server Memory: What Drives Its Growth?
ARM’s Zach Shelby writes that we’ve only scratched the surface for useful, well-connected devices, in IoT, A Market And Technology Set To Explode.
Atrenta’s Mark Baker and Ravindra Aneja have pulled together a detailed chart along with an explanation of how to manage constraints from RTL through post-layout in Constraints Ubiquity: Impact On Managing Design Closure?
