Top Stories

Thermal Floorplanning For Chips
Many factors influence how hot a die or IP will get, but if thermal analysis is not done, it can result in dead or under-performing systems.

Power, Performance — Avionics Designers Want It All
Design activity grows as companies adopt leading-edge technology, tools, and methodologies.

Customizing Chips For Power And Performance
Infineon’s CTO looks at new functional combinations and how they are changing chip design.

Blogs

Siemens EDA’s Harry Foster points to increased design size as only one dimension of the growing complexity challenge, in Beyond The Water Cooler: 2020 Report On IC/ASIC Design And Verification Trends.

Synopsys’ Gary Ruggles lays out three major changes in PCIe 6.0 that designers need to consider, in Getting Ready For An Efficient Shift To PCI Express 6.0 Designs With Optimized IP.

Arm’s Travis Walton and Udi Maor urge the industry to fix memory safety bugs and vulnerabilities before they become a big problem, in How To Improve Software? Start With The Hardware.

Rambus’ Frank Ferro explains why the same aspects that make GDDR ideal for demanding 3D graphics can boost edge inference, too, in Accelerating AI/ML Inferencing With GDDR6 DRAM.

Infineon’s Michael Ebli describes how to overcome temperature and endurance challenges in servo drive design, in SiC And Industrial Servos: A Perfect Match.

Ansys’ Anthony Dawson and Jane Trenaman list reasons to integrate the simulation tools used by different teams, in Using Model-Based Systems Engineering To Design Complex Systems.

Cadence’s Paul McLellan takes a look at some of the many ways to stack chips, in Advancing 3D Integration.