Top Stories

The Next Resists
Chemically amplified photoresists are out of steam where EUV is concerned.

Increasing Challenges At Advanced Nodes
GlobalFoundries’ CTO discusses new materials, stacked die, EUV, and 10nm planar FD-SOI.

Taming Mask Metrology
More measurements are required across more masks at advanced nodes, adding time and cost.

Blogs

Editor In Chief Ed Sperling argues that the success of China’s technology investments will hinge on what other governments allow, which may never be clear, in How Will China Spend $120B?

Executive Editor Mark LaPedus sits down with Nanoco’s CEO to talk about the latest advancements in LCD TVs, in Inside The Quantum Dot.

Mentor Graphics’ David Abercrombie digs into what affects the double patterning coloring process and what you need to know to make it work better, in Resetting Expectations On Multi-Patterning Decomposition And Checking.

Imec fellow Francky Catthoor, writing a guest blog for KLA-Tencor, contends that chip research and the chip industry are in no danger of hitting a wall, in Design Techniques Are Helping To Keep Moore’s Law Alive Longer.

Applied Materials’ Max McDaniels looks at new thin-film encapsulation technology, in Next Generation Technology For Flexible OLED Displays.

Semico Research’s Joanne Itow notes that the outlook for semiconductor growth is down for 2015 and 2016, but that could change quickly, in What’s On Your Holiday Gift List?

SEMI’s Clark Tseng finds six projects in the works in China in preparation for the IoT, in China’s MEMs Foundry Business Takes Shape.

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