Special Reports
Extending Copper Interconnects To 2nm
From low resistance vias to buried power rails, it takes multiple strategies to usher in 2nm chips.
Highly Selective Etch Rolls Out For Next-Gen Chips
Manufacturing 3D structures will require atomic-level control of what’s removed and what stays on a wafer.
Top Stories
Chiplets Enter The Supercomputer Race
Nations compete on speed using very different compute architectures.
GaN ICs Wanted For Power, EV Markets
For electric vehicles and power devices, device makers are working their way to GaN integrated circuits.
Blogs
Amkor’s Prasad Dhond details why choosing the right substrate design and surface plating process is key to ensuring supplier support, in Wirebond IC Substrates: Challenges Ahead.
Coventor’s QingPeng Wang explores potential design and manufacturing alternatives that avoid a large number of wafer runs, in Accelerating Semiconductor Process Development Using Virtual Design Of Experiments.
Lam Research’s Vahid Vahedi shows why selective isotropic etch is vital to creating new gate-all-around structures, in Precision Selective Etch And The Path To 3D.
SEMI’s Michelle Williams-Vaden examines ways to retain employees, in The Great Resignation And The Microelectronics Industry: Retaining A Skilled Workforce.
Brewer Science’s Jessica Albright explains how collaboration can help a business be a force for good, in The Challenge Doesn’t Stop At Certification: Post-B Corp Certification Reflections.
Ed Sperling highlights Semiconductor Engineering’s new technical paper library, in Technical Papers: Organized, Timely, And Relevant.
White Paper
Survey: 2022 Deep Learning Applications.
eBeam Initiative’s member list of deep learning projects they are undertaking in photomask to wafer semiconductor manufacturing.
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