Top Stories

The Growing Materials Challenge
New applications and continued device scaling are putting increasing emphasis on materials engineering.

Extending The IC Roadmap
Imec’s An Steegen sees advanced packaging as a critical component of future scaling, including new bridge technology.

Hardware-In-The-Loop Simulation, Testing
HIL simulation and testing is gaining new attention for embedded electronics in safety-critical markets.

Video

Tech Talk: 5G Everywhere
Where 5G works, where it doesn’t, and why it’s essential for so many markets.

Blogs

Editor In Chief Ed Sperling contends that confusion about what comes next in chip scaling is not a good thing, in New Transistor Types Vs. Packaging.

Technology Editor Jeff Dorsch points to VLSI Research’s list of test vendors, in The Best In Test.

Brewer Science’s Kim Yess explains what’s necessary to enable continued scaling and 3D integration, in Temporary Bonding: Enabling The Next Generation Of Ultrathin Wafers.

Advantest’s Judy Davies questions whether advances in prosthetics will give athletes an unfair advantage, in Heart Of A Champion.

Sponsor White Papers

Sacrificial Laser Release Materials For RDL-First Fan-Out Packaging
A look at the challenges and future direction of heterogeneous integration in the post-Moore’s Law era.

Generating And Debugging Constraints For High-Speed Serial Instruments
How to reduce the amount of time spent on R&D and speed time to market.

Putting “Design” Back Into Design For Test In PCB Products
Techniques to reduce the requirements for test points without sacrificing coverage.