Top Stories
True 3D Is Much Tougher Than 2.5D
While terms often are used interchangeably, they are very different technologies with different challenges.
The Race Toward Mixed-Foundry Chiplets
The challenges of assembling chiplets from different foundries are just beginning to emerge.
Managing EDA’s Rapid Growth Expectations
EDA is growing quickly, fueled by many changes in the chip industry. But can it keep up and continue to satisfy the needs of all its customers?
Blogs
Technology Editor Brian Bailey contends that existing EDA companies may be missing significant changes because they are not looking for true disruptions, in RISC-V Disrupting EDA.
Expedera’s Paul Karazuba digs into how the underlying test conditions come into play when looking at benchmark data, in Looking Beyond TOPS/W: How To Really Compare NPU Performance.
NI’s Kaitlynn Mazzarella and Marvin Landrum observe that efficiency increases when test measurement software is standardized across an organization, in Rethinking Validation To Improve Products Quicker.
Synopsys’ Taruna Reddy and Robert Ruiz predict that when AI-driven EDA flows can take on repetitive tasks, engineers gain the bandwidth to work on bug fixes and push their designs further, in How AI Drives Faster Verification Coverage And Debug For First-Time-Right Silicon.
Siemens’ Nebabie Kebebew explains why determining the type of cloud environment and which design and verification workflows to move is key to a successful migration, in System-On-Chip Design In The Cloud: One Size Does Not Fit All.
Renesas’ Graeme Clark looks at standardizing the communication between sensors and the host CPU, in The I3C Interface Can Help Improve Performance In Sensor Applications.
Keysight’s Jenn Mullen finds that big ideas and practical realities are often at odds when developing new product features, in Digital Twins Answer The Question, “What If?”
Cadence’s Paul Scannell sees the relationship between EDA suppliers and consumers changing, in Like Wayne Gretsky, EDA Aims To Be Where The Puck Is Going, Not Where It Has Been.
Codasip’s Lauranne Choquin points to growing momentum for customized RISC-V hardware, in Embedded World 2023: It’s Time To Architect All Ambitions With Custom Compute.
Movellus’ Barry Pangrle digs into how monitoring systems and quickly adjusting clock frequencies improves performance for specific applications and operating environments, in Squeezing The Margins.
Sponsor White Papers
A Hierarchical And Tractable Mixed-Signal Verification Methodology For First-Generation Analog AI Processors
Mythic AI’s methodology for creating their unique analog AI ICs leverages Siemens EDA’s Analog FastSPICE and Symphony solutions.
PCIe 6.0 Electrical Testing For High Data-Bandwidth Applications
The nitty gritty of testing PCIe 6.0, with PAM 4 and error detection and correction.
Renesas / Cyberon Speech Recognition
A different approach to endpoint embedded voice user interfaces.
2023 Open Source Risk In M&A By The Numbers
The many ways an open source audit can benefit your organization.
Compact NN Accelerator In CodAL
Simplify running AI algorithms on embedded platforms, from a software and hardware point of view.
Using Simulation To Overcome Three Millimeter-Wave Design Challenges
Three simulation techniques help designers overcome mmWave design challenges to ensure their devices meet the 5G NR specification.
eBook (Premium Content)
China Chip Industry Startup Funding Annual Report & Analysis: 2022
As export rules tighten, China is racing to stay competitive in chips. In 2022, that included at least $19 billion in investments, 821 funding rounds, and 700 startups.
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