Special Report
Different Approaches Emerge For Stacking Die
First of two parts: While full logic-on-logic 3D ICs are still in the experimental stage, other approaches are beginning to take shape.
Top Stories
Looking For The Next Big Thing
Who will win the IoT race? Judging from the amount of debate it’s still too early to to call the winners, or even how the market will shape up.
The Changing IP Ecosystem
Can the smaller IP providers keep up and afford the requirements of delivering what is needed for 20nm and below?
More Than Moore
Experts at the table, part 1: Where Moore’s law will continue to work, where it won’t, and what the likely result will be.
IP Subsystems: What Works, What Doesn’t
With all of the changes the SoC has undergone in the past 10 years, it’s no wonder the definition of an IP building block has evolved too.
Blogs
Editor In Chief Ed Sperling contends that the uncertainty among foundries, OSATs and customers about which way to go next will have a profound impact on EDA companies in Ready To Pounce.
Technology Editor Brian Bailey observes that a lack of VC funding could have a lasting impact on electronic design automation in EDA Suffering Funding Crisis.
Mentor Graphics’ Jon McDonald notes that choosing which IP to use and re-use can have a big impact on the overall design in Not Invented Here Syndrome.
Cadence’s Frank Schirrmeister questions whether there is one right answer in When To Virtualize, When To Stay In The Real World.
Synopsys’ Tom De Schutter wonders what to do when the pilot says there is just enough fuel to make it in Just About Enough Virtual Prototyping.
Arteris’ Kurt Shuler writes that reducing active power consumption by 0.7 milliwatts can mean a lot if it affects 1 billion phones in NoC Technology: Saving the Planet, One Chip at a Time.
Sponsor White Papers
A Novel Approach To Dummy Fill For Analog Designs
How dummy patterns can be customized and controlled from a design entry system.
Transaction Debug
How to correlate software and hardware debug approaches.
