Semiconductor Engineering LPHP

Will Monolithic 3D DRAM Happen?
New and faster memory designs are being developed, but their future is uncertain.

Fraunhofer IIS EAS’ André Lange finds a growing need for aging models to ensure reliability, in The Importance Of Aging Simulation In IC Design.

Arm’s Fernando García Redondo, Pranay Prabhat, and Mudit Bhargava dig into the behavior of MRAM switching at significant statistical events, in Reliable And Efficient Compact Models For Scalable MTJ Simulation.

Synopsys’ Priyank Shukla lays out how to accelerate the path to compliance and design closure for HPC SoCs, in Integrated Ethernet PCS And PHY IP For 400G/800G Hyperscale Data Centers.

Siemens EDA’s Derong Yan questions whether the shortest path is useful when debugging resistance, in The Shortest Path Deception.

Cadence’s Paul McLellan looks at the processors that will that power most of the upcoming laptops, servers, and gaming consoles, in The Next Generation Of General-Purpose Compute At Hot Chips.

Rambus’ Frank Ferro predicts we’re at the cusp of another generational change in HBM, in On The Road To Higher Memory Bandwidth.

Ansys’ Marc Swinnen explains how speed and integration density are affecting semiconductors, PCBs, systems, and photonics, in The Impact Of Multiphysics On Production Electronic Design.

Infineon’s Zhihui Yuan looks at the differences in the short-circuit behavior of SiC MOSFET and IGBT devices, in Short-Circuit Ruggedness In SiC MOSFETs.