Top Stories
200mm Crisis?
Demand is up, capacity is flat. A look at what’s behind this imbalance.
Extending EUV Beyond 3nm
Now that EUV is finally shipping, companies are working on extending it much further using anamorphic lenses and high numerical aperture technology.
Materials For Future Electronics
Flexible electronics, new memory types, and neuromorphic computing dominate research.
Blogs
Editor In Chief Ed Sperling contends that developing EUV was only the first step. Selling it to the semiconductor industry comes next, in High-Stakes Litho Game.
Executive Editor Mark LaPedus examines new nodes and sextuple patterning, in Notes From The Chip Beat.
The eBeam Initiative’s Jan Willis interviews Imec’s top patterning guru, in The Future Of Patterning.
Coventor’s Michael Hargrove digs into the impact of spacer-based deposition and etch on RC and device performance, in What Drives SADP BEOL Variability?
GlobalFoundries’ Igor Arsovski looks at using application-specific memory to improve data center search bandwidth, in 1.41 ‘Giga-Searches’ Per Second?
SEMI’s Lara Chamness predicts fab spending will continue throughout 2018, in North America Equipment Market Rebounds.
Sponsor White Paper
A Look At Atomic Layer Deposition
How ALD compares with CVD, PECVD, and how it matches up with ALE.
