Top Stories

Some Chipmakers Sidestep Scaling, Others Hedge
No shortage of alternatives as materials, packaging and architectural options grow, and plenty of startups are jumping in.

EUV Mask Blank Battle Brewing
Applied Materials circles market as demand for next-gen technology grows.

Multi-Beam Mask Writing Finally Comes Of Age
IMS’ chief executive talks about why multi-beam e-beam is an essential companion tool for EUV.

Video

Smart Manufacturing
How to utilize manufacturing data and AI/ML to improve efficiency and yield.

Blogs

Editor In Chief Ed Sperling looks at why AI, and systems companies designing their own chips, could alter semiconductor manufacturing, in 2 Big Shifts, Lots Of Questions.

Executive Editor Mark LaPedus digs into why DRAM and NAND fell off the cliff in ’18, with no relief in sight for ’19, in What’s The Outlook For Memory?

Applied Materials’ Michael Stewart contends that chip startups see opportunities to change the AI ecosystem amid a dramatic increase in investment, in A VC View Of The AI Landscape.

GlobalFoundries blogger Gary Dagastine finds that scaling still has a place, but existing technologies hold the power to push computing in new directions, in Finding New Dimensions Of Innovation.

SEMI’s Ayo Kajopaiye digs into efforts to optimize processes based on analysis of production and sensor data, in Smart Manufacturing Initiative.

Technical Paper

Matching Between Simulations And Measurements As A Key Driver For Reliable Overlay Target Design
Comparing overlay target simulations and actual measurements identifies inaccuracies in models and can help designers improve models.