Top Stories
Building Better Bridges In Advanced Packaging
Leading-edge applications, from biotech to co-packaged optics, require choices in architectures, assembly methods, and materials for system performance.
When And Where To Implement AI/ML In Fabs
Smarter tools can improve process control, identify the causes of excursions, and accelerate recipe development.
Ferroelectric Memories Answer Call For Non-Volatile Alternatives
Researchers target NVMs that are compatible with CMOS logic.
Data Management Challenges In Heterogeneous Systems
Who owns the data, how to secure it, and who can monetize it still need to be resolved.
Videos
Challenges Of Testing Advanced Packages
Bundling more chips or chiplets increases the difficulty of thoroughly testing a device.
Blogs
Amkor’s SeokHo Na, MinHo Gim, GaHyeon Kim, DongSu Ryu, DongJoo Park, and JinYoung Kim investigate a LAB process where the laser emission from the bottom BGA side to bump is transmitted through the stage vacuum block, in Reverse Laser Assisted Bonding (R-LAB) Technology For Chiplet Module Bonding On Substrate.
eBeam Initiative’s Jan Willis makes the case that wire length reduction techniques such as curvy target shapes are needed to reduce congestion, in Why Curvy Design Now? Manufacturing Is Possible And Scaling Needs It.
Brewer Science’s Jessica Albright presents methods for detecting and reducing defects in the fab and supply chain, in 5 Reasons Why Defect Reduction Is Critical In Semiconductor Material Success.
Advanced Energy’s Vitaly Petrishchev addresses the need for Angstrom Era precision and control with RF generator platforms, in New Plasma Power Technologies For Next-Gen Semiconductor Manufacturing.
Sponsor White Papers
Reliability Performance Of S-Connect Module (Bridge Technology) For Heterogeneous Integration Packaging
Recent work on a chip-last S-Connect with up to 3x reticle-sized modules.
Functionalized Carbon Nanotubes Enabled Flexible And Scalable CO2 Sensors
A low-cost and effective chemiresistive CO2 sensor based on a composite of functionalized carbon nanotubes (f-CNTs) with polyethyleneimine (PEI).
New Research eBook
Chiplets: Deep Dive Into Designing, Manufacturing, And Testing
Chiplets may be the semiconductor industry’s hardest challenge yet, but they are the best path forward.
Newsletter Signup
Find our email newsletter signup page here.
