Reliability Performance Of S-Connect Module (Bridge Technology) For Heterogeneous Integration Packaging

Recent work on a chip-last S-Connect with up to 3x reticle-sized modules.


Bridge technology is a promising heterogeneous integration (HI) solution for application-specific integrated circuits (ASICs) and high bandwidth memory (HBM). The bridge dies provide localized communications among the multiple system on chips (SoCs) in a single package. In Amkor’s bridge technology, S-Connect provides die-to-die connections with fine pitch [1]. Prototype S-Connect technology was first reported in 2021 with a chip-first process. . . . The results show that the chip-last S-Connect can be an advanced package solution for high-end applications.

Authors from R&D, Amkor Technology Korea, Incheon, Korea:

  • Heejun Jang
  • Kyun Ahn
  • Haesung Par
  • Gamhan Yong
  • Jihyun Ki
  • YeonKi Jeong
  • EunSook Sohn
  • Taekyeong Hwang
  • Wonchul Do
  • JinYoung Khim

Advanced Package and Technology Integration, Amkor Technology,Inc., Tempe, AZ, USA:

  • Dave Hiner
  • Mike Kelly

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H. Jang et al., “Reliability Performance of S-Connect Module (Bridge Technology) for Heterogeneous Integration Packaging,” 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 1027-1031, doi: 10.1109/ECTC51909.2023.00175.

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