Recent work on a chip-last S-Connect with up to 3x reticle-sized modules.
Bridge technology is a promising heterogeneous integration (HI) solution for application-specific integrated circuits (ASICs) and high bandwidth memory (HBM). The bridge dies provide localized communications among the multiple system on chips (SoCs) in a single package. In Amkor’s bridge technology, S-Connect provides die-to-die connections with fine pitch [1]. Prototype S-Connect technology was first reported in 2021 with a chip-first process. . . . The results show that the chip-last S-Connect can be an advanced package solution for high-end applications.
Authors from R&D, Amkor Technology Korea, Incheon, Korea:
Advanced Package and Technology Integration, Amkor Technology,Inc., Tempe, AZ, USA:
Click here to read more. Access to the document requires a subscription.
 |
 |
 |
 |
 |
 |
 |  |
Leave a Reply