Special Report
The Limits Of AI’s Role In EDA Tools
AI is a set of algorithms capable of solving problems. But how relevant are they to the tasks that EDA performs?
Top Stories
Navigating The Challenges Of Group Design Projects
As more companies and startups join forces with government and academia in chip design projects, issues around data sharing, IP protection, and PDK access must be solved.
First Forays Into True 3D-IC Designs
Risk is high for pioneers of chiplet stacking, but the rewards could be significant. This will get easier, though.
AI’s Value In Chip Design Depends On Data Availability
AI can help engineers do their jobs better, but results can vary greatly by area of expertise and company size.
New Demands For IP Reuse
IP can no longer be developed and verified outside of the context of the system in which it is expected to operate — unless we develop new verification methodologies.
The Future Of Verification
While the evolution of verification may have slowed down, the industry is hitting a tipping point that will drive some major changes. Can verification get ahead of the problem?
Video
Benefits And Challenges Of Using Chiplets
Coherent vs. non-coherent interfaces, heterogeneous vs. homogeneous, and other considerations with chiplets.
Opinion
Technology Editor Brian Bailey finds that nobody is clear on how AI will disrupt design workflows, highlighting the difficulty in making predictions, in What Does Semiconductor Disruption Look Like?
Sponsor Blogs
ChipAgents’ Yuheng Tang and Kexun Zhang point out that AI has already begun enhancing RTL design workflows but its exploration in verification remains in early stages, in AI Agents For UVM Generation: Challenges And Opportunities.
Arteris’ Andy Nightingale explains why emerging chiplet, memory, and interconnect technologies need layered, automated solutions to deliver predictable performance, in The Future Of SoC Design Is Data Movement.
Siemens EDA’s John Ferguson explains how a holistic approach that treats the stack as a coupled physical system helps overcome thermal, stress, and reliability challenges, in How Multiphysics Is Powering The Future Of 3D-ICs.
Synopsys’ Chahinez Hamlaoui and Robert Fey and IPG Automotive’s David Howarth point out that as the number of ECUs in modern vehicles climbs, traditional development and testing approaches are struggling to keep pace, in The Critical Role Of Virtualization In Automotive Software Development For Software-Defined Vehicle.
Cadence’s Vanessa Do talks about eliminating the constraints of traditional, fixed-memory architectures and the need for flexible memory expansion and memory sharing among devices, in Boosting AI Performance With CXL.
Keysight’s Carmina Stremlau explains why collaboration across industry, academia, and research labs is driving the future of semiconductor design, in Why The Next Breakthrough In Chips Depends On Rethinking Design Workflows.
Keysight’s Jenn Mullen looks at the expansion of quantum technology from research laboratories and university classrooms into our daily existence, in The Joy Of Quantum: Celebrating Wonder And Sharing The Magic.
Sponsor White Papers
Speeding Time To Market With A Future-Proof Fabric
How Tenstorrent is elevating its AI fabric to new heights of performance, efficiency, and productivity.
Beyond the Bottleneck: AI Cluster Networking Report 2025
Trends, investments, and optimization strategies to unlock the potential of AI data centers.
Preparing For The Multiphysics Future Of 3D-ICs
To ensure the successful implementation of 3D-ICs, new design and verification challenges must be addressed.
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