Special Report
5G Chips Add Test Challenges
No cost-effective production solution yet for mmWave.
Top Stories
Cleaning Up During IC Test
Dirty probe tips and sockets adversely affect test, which can impact chip reliability.
IC Data Hot Potato: Who Owns And Manages It?
Dealing with a deluge of data in IC inspection, metrology, and test.
Video
Design For Test Data
Creating chips that can be tested throughout their expected lifetimes.
Blogs
KLA’s Jeff Barnum looks at what’s changing in vehicles and how that will impact chip inspection, metrology, and manufacturing, Automotive Innovations In Semiconductors.
Siemens EDA’s Geir Eide demonstrates effective and tunable bus-based scan data distribution, in Packetized Scan Test Delivery.
Onto Innovation’s Mike McIntyre explains how to use yield analytics and consolidated data to power a factory, in What Does It Take To Build A Successful Multi-Chip Module Factory?
Advantest’s Alan Hart urges removing the need to manually review anomalous data points by automatically triggering retest actions, in Driving Toward Predictive Analytics With Dynamic Parametric Test.
Sponsor White Papers
Achieving CDC Signoff On Multi Billion Gate Designs With Hierarchical CDC Flow
VC SpyGlass’ hierarchical CDC signoff methodology to verifies clock domain crossing problems at the SoC level.
Development Of High Voltage General-Purpose Pin-Electronics
An example of how to improve the trade-off in the general purpose pin-electronics by using the LDMOS process.
Advanced Mm-Wave And Terahertz Measurements With Cascade Probe Stations
How to achieve consistent and repeatable, automatic test results using custom DC positioners with theta-X planarizing capability and true Kelvin probes for micro-bump resistance measurements as well as standard DC probes for wafer surface leakage measurements.
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