Top Stories
Inspecting, Testing, And Measuring SiC
Demand for solutions is booming, but the technology is just beginning to gain its footing.
One Test Is Not Always Enough
Combining two test parameters to make a pass/fail decision is getting easier.
PCB And IC Technologies Meet In The Middle
Surface mount technology is changing in some surprising ways.
Tech Talks
Total Critical Area For Optimizing Test Patterns
Using data to target areas on a chip where defects are most likely to occur.
Growing Challenges With Wafer Bump Inspection
Co-planarity, variation and data collection emerge as top issues.
Blogs
Editor in chief Ed Sperling finds that options are plentiful, but so are the possible unknowns, in The Everything New Syndrome.
Synopsys’ Rahul Singhal and Giri Podichetty examine why unknowns create problems for test time and coverage, in Don’t Let X Be A Problem For Logic BIST.
Siemens EDA’s Geir Eide showcases the latest IC test technologies, in Packetized Test At The International Test Conference 2021.
Sponsor White Papers
Manage Scaling Challenges For Silicon Success
Why new tools for test and monitoring are vital in today’s changing semiconductor landscape.
Advanced Outlier Die Control Technology In Fan-Out Panel Level Packaging Using Feedforward Lithography
A demo of advanced outlier control technology with feedforward lithography and a review of how this integration technology can maintain yield and throughput under such challenging conditions.
High-Speed Image Processing By GPU
Using CPU and GPU together, the study shows an increased speed in filter function for imaging tests using Next IPE, the image processing engine of the T2000 CMOS Image Sensor Solution.
Accelerating Verification Shift Left With Intelligent Coverage Optimization
New tools or technologies that can accelerate coverage convergence, expose bugs early in the design cycle, reduce debug effort, and improve verification turnaround time.
Newsletter Signup
Find our email newsletter signup page here.
