Top Stories
Lithography Options For Next-Gen Devices
EUV is the clear winner down to 5nm, but what comes after that may be a combination of tools and techniques.
Inspecting IC Packages Using Die Sorters
Die sorters are crucial for finding cracking defects in optoelectronics, sensors and advanced nodes.
Moore’s Law Now Requires Advanced Packaging
Experts at the Table, part 1: Shrinking features isn’t enough anymore. The big challenge now is how to achieve economies of scale and minimize complex integration issues.
Blogs
Editor In Chief Ed Sperling finds that accuracy is becoming a differentiator in everything from design through manufacturing, in The Precision Knob.
Executive Editor Mark LaPedus reports that events in China and elsewhere are impacting the market for rare earths, in More Rare Earth Rumblings.
Brewer Science’s Tony Flaim describes polymer substrates that add interesting capabilities to printed electronics, in New Plastics Can Speed Flexible Printed Electronics Development.
Applied Materials’ Gill Lee explains why key characteristics of three emerging memories make them well-suited for different applications, in Comparing New Memory Types.
Lam Research’s Steve Proia talks about the journey of silicon to its many uses, in From Sand To Wafers.
SEMI’s Sungho Yoon questions whether the memory slowdown will continue, or whether a rebound is coming soon, in Finding The Bottom Of The Memory Trough.
Sponsor White Papers
Self-Aligned Fin Cut Last Patterning Scheme For Fin Arrays Of 24nm Pitch And Beyond
Learn about a finFET process flow with various fin cut approaches to create a 3D model of a FinFET SRAM device.
ALD Tungsten Solves Capacity Challenges In 3D NAND Device Manufacturing
ALD (atomic layer deposition) controls specific reactant molecules precisely within each cycle, unlike CVD.
Lithography Challenges For Leading Edge 3D Packaging Applications
Simpler single pass topside test can provide reasonable accuracy for monitoring processes that align to embedded targets.
Leveraging The Digital Twin In Smart Microelectronics Manufacturing
How to use digital twins in semiconductor manufacturing.
