Special Report
Unintended Coupling Issues Grow
More complex and increasingly heterogeneous designs, and multiple dies in a package, increase potential for unwanted interactions.
Top Stories
Data Center Architectures In Flux
Processor market pushes toward customized multi-chip systems, creating churn and new opportunities; RISC-V emerges as both catalyst and opportunity.
Why RISC-V Is Succeeding
Interest in this particular ISA is expanding, but the growth of other open-source hardware is less certain.
Preparing For 3D-ICs
Why disaggregation of 2D chips is so complicated, and what’s missing from the tool chain to make it easier for design teams.
Design Challenges Increasing For Mixed-Die Packages
The good and bad of assembling dies from different foundries.
Blogs
Editor-in-Chief Ed Sperling looks at Intel’s support for RISC-V marking a technological and cultural shift, in Which Processor Is Best.
Technology Editor Brian Bailey finds plenty of misguided complaints across the industry, in Does EDA Sell Fear?
Siemens’ Tarek Ramadan looks at ensuring the intended connectivity of the die, silicon interposer, and organic substrate, in Dissolving The Barriers In Multi-Substrate 3D-IC Assembly Design.
Cadence’s Frank Schirrmeister examines how generational changes of the end customer base may impact electronics, in Are Sustainability And Safety Gen Z’s Top Requirements In 2031?
Synopsys’ Taruna Reddy shows how leveraging recorded signal activity from previous full-chip simulations accelerates time-to-debug, in Intelligent Waveform Replay For Efficient Debug.
Codasip’s Rupert Baines contends that for many systems, the best processor is one tailored for its task, in How To Extend The ‘Unscalable’ RISC Architectures.
White Papers
Image Processing For Vision AI.
Addressing Library Characterization And Verification Challenges Using ML.
Achieving C-V2X Compliance.
Fuzz Testing Software-Defined Vehicles Using Agent Instrumentation.
RF To MmWave Design For Systems.
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