A design environment for combining RFIC and MMIC designs on a substrate with newer packaging and integration.
RF-enabled next-generation communication systems and connected devices are differentiated by their performance, size, and cost. Traditionally, custom proprietary IC designs, leveraging the latest advanced-node technology, were developed to meet these product requirements. Increasingly these challenges are being met by moving beyond single IC solutions. Today’s electronic systems often integrate heterogeneous technologies to mitigate the high cost of homogeneous system-on-chip (SoC) solutions by enabling designers to combine proven RFIC and monolithic microwave IC (MMIC) designs on substrates using newer packaging and integration technologies. RF to mmWave Design for Systems Empowered by AWR Design Environment V16
Engineers trying to bring these products to market need best-in-class simulation technology and design automation to accurately predict the performance of larger, densely integrated circuits and subsystems designed for broadband and millimeter-wave (mmWave) spectrum. In addition, since these products are developed by diverse engineering teams across multiple design tools, RF design software must provide interoperability with the broader class of EDA tools used in the development of mixed-signal electronic systems.
Click here to read more in this technical brief about AWR Design Environment V16.
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