Noise Abatement


[getkc id="285" kc_name="Noise"] is a fact of life. Almost everything we do creates noise as a by-product and quite often what is a signal to one party is noise to another. Noise cannot be eliminated. It must be managed. But is noise becoming a larger issue in chips as the technology nodes get smaller and packaging becomes more complex? For some, the answer is a very strong yes, while for ot... » read more

Integrated Photonics


Semiconductor Engineering sat down to discuss the status of integrated photonics with Twan Korthorst, CEO for PhoeniX Software; Gilles Lamant, distinguished engineer for [getentity id="22032" e_name="Cadence"]; Bill De Vries, director of marketing for Lumerical Solutions; and Brett Attaway, director of EPDA solutions at AIM Photonics, SUNY Polytechnic Institute. What follows are excerpts of tha... » read more

Fusing CMOS IC And MEMS Design For IoT Edge Devices


Creating a sensor-based IoT edge device is challenging, due to the multiple design domains involved (Analog, digital, RF, and MEMS). But, creating an edge device that combines the electronics using the traditional CMOS IC flow and a MEMS sensor on the same silicon die can seem impossible. In fact, many IoT edge devices combine multiple dies in a single package, separating electronics from the M... » read more

How To Build An IoT Chip


Semiconductor Engineering sat down to discuss IoT chip design issues with Jeff Miller, product marketing manager for electronic design systems in the Deep Submicron Division of [getentity id="22017" e_name="Mentor, a Siemens Business"]; Mike Eftimakis, IoT product manager in [getentity id="22186" comment="ARM"]'s Systems and Software Group; and John Tinson, vice president of sales at Sondrel Lt... » read more

Module Testing Adds New Challenges


System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is something more than a chip package and a great deal smaller than most printed circuit boards. Testing these modules often requires system-level test. These modules typically will be inserted int... » read more

Testing IoT Devices


Internet of Things devices present new challenges in testing. Some devices can be tested the same way as standard semiconductors are now tested, but others call for different approaches. Microcontrollers and other chips that go into safety-critical applications — medical devices, military/aerospace systems, and automotive electronics — need their own kind of testing to make sure they wil... » read more

200mm Crisis?


Over the last year or so, the IC industry has experienced an acute shortage of both 200mm fab capacity and 200mm equipment amid a surge of demand for certain chips. Right now, though, the 200mm shortfall is much worse than before. But this situation isn’t expected to improve for both elements in the second half of 2017, and perhaps beyond. On the capacity front, chipmakers are generally... » read more

RF Device And Process Biz Heats Up


The RF device and process technology markets are heating up, especially for two critical components used in smartphones—RF switch devices and antenna tuners. RF device makers and their foundry partners continue to ramp up traditional RF switch chips and tuners based on RF SOI process technologies for today’s 4G wireless networks. And recently, [getentity id="22819" comment="GlobalFoundri... » read more

Time For Massively Parallel Testing


Time is money in electronics, as in other industries, and the more time that is invested in testing chips means more costs being added to the product in question. To speed up testing for memory devices and other semiconductors, test equipment vendors have resorted to parallel testing technology, simultaneously testing multiple chips at a time. The industry also is turning to system-level tes... » read more

Custom Chip Verification Issues Grow


With the transition to finFETs, design conditions have grown more intense. They now include a wider PVT range and less headroom. As a result, electronic systems for applications such as mobile, consumer, and automotive increasingly are becoming more difficult to design due to the exacting performance requirements of these applications. This is particularly evident in custom design, including... » read more

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