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Advantages Of Picosecond Ultrasonic Technology For Advanced RF Metrology


This paper is from China Semiconductor Technology International Conference (CSTIC). Picosecond Ultrasonics (PULSE Technology) has been widely adopted as the tool-of-record for metal film thickness metrology in semiconductor fabs around the world. It provides unique advantages, such as being a rapid, non-contact, non-destructive technology, and has capabilities for simultaneous multiple layer... » read more

Meeting The Challenges Of 5G RF Production Test Services


Implementation of the 5G radio frequency (RF) standard is increasing rapidly [1]. Over the past four to six quarters, there has been an increased focus on publications and products that have been introduced to the marketplace. Some of the more popular RF eco-system applications include cellphone, Wi-Fi, automotive, Internet of Things (IoT), location services, and more. Wi-Fi and cellphone servi... » read more

Packaging Demands For RF And Microwave Devices


RF and microwave integrated circuits (ICs), monolithic microwave ICs (MMICs) and systems in package (SiPs) are vital for a wide range of applications. These include mobile phones, wireless local-area networks (WLANs), ultra-wideband (UWB), internet-of-things (IoT), GPS and Bluetooth devices. Moreover, RF-optimized packaging products and processes are essential to enabling the 5G ramp-up. RFI... » read more

WLFO For High-Performance Low-Cost Packaging Of RFMEMS-CMOS


Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of micro-electromechanical systems (MEMS), either monolithic or heterogeneous, introduces yet another level of complexity that has only recently been a major focus of multi-device packaging. Wafer-level fanout (W... » read more

Full Metrology Solutions For Advanced RF With Picosecond Ultrasonic Metrology


Picosecond Ultrasonics (PULSE Technology) has been widely used in thin metal film metrology because of its unique advantages, such as being a rapid, non-contact, non-destructive technology and its capabilities for simultaneous multiple layer measurement. Measuring velocity and thickness simultaneously for transparent and semi-transparent films offers a lot of potential for not only monitoring ... » read more

200mm Demand Surges


A surge in demand for various chips is causing shortages for select 200mm foundry capacity as well as 200mm fab equipment, and it shows no signs of abating in 2021. Foundry customers will face a shortfall of 200mm capacity at select foundries at least in the first half of 2021, and perhaps beyond. Those customers will need to plan ahead to ensure they obtain enough 200mm capacity in 2021. Ot... » read more

How To Speed Up Large-Scale EM Simulation Of ICs Without Compromising Accuracy


With growing on-chip radio frequency (RF) content, electromagnetic (EM) simulation of the passives is critical for a variety of reasons — from selecting the right RF design candidates to detecting parasitic coupling that directly impacts performance. Being on-chip, accurate EM analysis requires a tie into the process technology in the form of process design kits (PDKs) as well as a foundry-ce... » read more

System Simulation For RF Link Budget Analysis


This white paper examines how a more rigorous link budget analysis of an entire system can be determined through simulation, and how performing link budget analysis enables designers to address losses, gains, and power levels to meet the operational requirements of the radio communications system. Click here to read more. » read more

Emerging Apps And Challenges For Packaging


Advanced packaging is playing a bigger role and becoming a more viable option to develop new system-level chip designs, but it also presents chipmakers with a confusing array of options and sometimes a hefty price tag. Automotive, servers, smartphones and other systems have embraced advanced packaging in one form or another. For other applications, it's overkill, and a simpler commodity pack... » read more

Packaging Demands For RF And Microwave


RF and microwave integrated circuits (ICs), monolithic microwave ICs (MMICs) and systems in package (SiPs) are vital for a wide range of applications. These include mobile phones, wireless local-area networks (WLANs), ultra-wideband (UWB), internet-of-things (IoT), GPS and Bluetooth devices. Moreover, RF-optimized packaging products and processes are essential to enabling the 5G ramp-up. RFI... » read more

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