Multiphysics Simulations For RFICs And SoCs For 5G Applications


System-on-chips (SoCs) and radio frequency integrated circuits (RFICs) for 5G smartphones and networks need to manage huge amounts of antenna data and offer significantly high processing capabilities in thermally and power-constrained environments. ANSYS multiphysics simulations simultaneously solve power, thermal, variability, timing, electromagnetics and reliability challenges across the spec... » read more

Standardizing Platforms From Characterization To Production


In 1983, the first commercial mobile phone retailed for $3995, almost $10,000 in today’s economy. It supported a single band, weighed almost a kilogram, and was about the size of a brick. Two decades later, a quad-band “world phone” costs a few hundred dollars. Even a basic mobile phone that supports over 20 cellular bands, in addition to Bluetooth, Wireless LAN, and GPS technology, ... » read more

Inside Advanced Packaging


Semiconductor Engineering sat down to discuss advanced IC-packaging, the OSAT industry, China and other topics with Ron Huemoeller, vice president of worldwide R&D at Amkor. What follows are excerpts of that conversation. SE: Where are we in advanced IC-packaging today? Huemoeller: We’ve hit the inflection point. Now we are coming to the other side of it. Regarding this need to int... » read more

A Faster, More Accurate Approach For System-Level Performance Verification Of A Wireless RFIC Design


Wireless RFIC designs are growing more complex, increasing the challenge of verifying system-level performance. Designers are expected to be experts on a variety of ever-changing wireless standards and protocols. They must also contend with time-consuming manual simulation setup and post-processing of the simulation results. This paper discusses how an advanced simulation methodology, involving... » read more