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System-In-Package Thrives In The Shadows


IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly under the radar because it adds a competitive edge. With a SiP, several chips and other components are integrated into a package, enabling it to function as an electronic system or sub-system. ... » read more

The Search For 5G mmWave Filters


Cellular telephone technology takes advantage of a large number of frequency bands to provide ever-increasing bandwidth for mobile use. Each of those bands needs a filter to keep its signals separate from other bands, but the filter technologies in current use for cellphones may not scale up to the full millimeter-wave (mmWave) range planned for 5G. “MmWave will happen,” said Mike Eddy, ... » read more

RF To Millimeter-Wave Front-End Component Design Trends For 5G Communications


This white paper discusses design challenges and solutions related to the "third wave" of communications, presenting several case studies in which the Cadence AWR Design Environment platform has been used to develop products for 5G and beyond. Examples include a multiband active antenna tuner for cellular internet of things (IoT) machine-type communications (mMTC) applications, a linear power a... » read more

AiP/AiM Design For mmWave Applications — Advanced RF Front-End Design Flows From Concept To Signoff


System requirements for broad bandwidth, millimeter-wave (mmWave) spectrum, phased arrays, and integrated antennas and front-ends are evolving. The challenge for engineers will be achieving the cost, size, and performance requirements that will make these products commercially viable. All these factors align to drive next-generation component integration, which includes embedding the antenna wi... » read more

Power/Performance Bits: May 25


5G energy harvesting Researchers at Georgia Institute of Technology propose a way to harvest power for IoT devices using 5G networks. The team's device uses a flexible Rotman lens-based rectifying antenna (rectenna) system capable of millimeter-wave harvesting in the 28-GHz band. “With this innovation, we can have a large antenna, which works at higher frequencies and can receive power fr... » read more

mmWave Chip, Package, And Board Beamforming Solutions


RF front-end architectures grow more complex with each generation of communication systems. To accommodate these architectures, more densification and miniaturization is taking place with electronic systems implemented through innovations in system-in-package (SiP) design. 5G data rates exceeding 1GB/s will be supported by the available bandwidth in the millimeter-wave (mmWave) spectrum and ... » read more

Week In Review: Auto, Security, Pervasive Computing


Pervasive computing — data center, edge, IoT Marvell is working on silicon for the data infrastructure market using TSMC’s 5nm process node. Marvell says it has multiple designs already under contract for its 5nm portfolio across the carrier, enterprise, automotive, and data center markets. The first products are sampling by the end of next year.  Ansys’ multiphysics signoff tools, R... » read more

Power Amp Wars Begin For 5G


Demand is increasing for power amplifier chips and other RF devices for 5G base stations, setting the stage for a showdown among different companies and technologies. The power amplifier device is a key component that boosts the RF power signals in base stations. It's based on two competitive technologies, silicon-based LDMOS or RF gallium nitride (GaN). GaN, a III-V technology, outperforms ... » read more

Week In Review: Manufacturing, Test


Packaging Chunghwa Telecom, ASE and Qualcomm Technologies have announced plans to jointly build Taiwan's first 5G mmWave enterprise private network smart factory. As part of the plan, ASE is deploying a series of smart factory technologies within its existing Kaohsiung, Taiwan-based campus. This includes the deployment of 5G mmWave network cells in the Kaohsiung campus. Qualcomm will be ... » read more

From Cloud To Cloudlets


Cloudlets, or mini-clouds, are starting to roll out closer to the sources of data in an effort to reduce latency and improve overall processing performance. But as this approach gains steam, it also is creating some new challenges involving data distribution, storage and security. The growing popularity of distributed clouds is a recognition that the cloud model has limitations. Sending the ... » read more

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