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The Great Migration To 5G Is Underway


Every decade brings with it a plethora of technology changes, and the cumulative effects of 50+ years of changes in wireless technologies are noteworthy for how they have changed the way we communicate. The 80’s began the era of personal computing along with 1G rollout The 90’s saw the advent of 64-bit microprocessor architecture in consumer devices coinciding with 2G rollout The... » read more

Revising 5G RF Calibration Procedures For RF IC Production Testing


Modern radio frequency (RF) components introduce many challenges to outsourced semiconductor assembly and test (OSAT) suppliers whose objective is to ensure products are assembled and tested to meet the product test specifications. The growing advancement and demand for RF products for cellphones, navigational instruments, global positioning systems, Wi-Fi, receiver/transmitter (Rx/Tx) componen... » read more

Measuring Frequency Dependence Across 5G mmWave Bands (NIST)


New research paper from NIST, "Methodology for Measuring the Frequency Dependence of Multipath Channels Across the Millimeter-Wave Spectrum." Abstract "Millimeter-wave (mmWave) communications promise Gigabit/s data rates thanks to the availability of large swaths of bandwidth between 10–100 GHz. Although cellular operators prefer the lower portions of the spectrum due to popular belief ... » read more

Tile-based massively scalable MIMO and phased arrays for 5G/B5G-enabled smart skins and reconfigurable intelligent surfaces


New technical paper from Georgia Tech. Abstract "This work presents a novel tile based approach to constructing, in a modular fashion, massively scalable MIMO and phased arrays for 5G/B5G millimeter-wave smart skins and large-area reconfigurable intelligent surfaces for Smart Cities and IoT applications. A proof-of-concept 29 GHz 32 elements phased array utilizing 2×2 “8-element subarr... » read more

A compact two elements MIMO antenna for 5G communication


Abstract: "This study presents a simple, miniaturized, and low-profile multiple-input multiple-output (MIMO) antenna operating at 29 GHz with reduced mutual coupling between the antenna elements for futuristic 5G communication. The proposed design employs two radiating elements with slits in the radiators to produce high isolation among the antenna radiators. The MIMO antenna maintains a compa... » read more

RF To mmWave Design For Systems


RF-enabled next-generation communication systems and connected devices are differentiated by their performance, size, and cost. Traditionally, custom proprietary IC designs, leveraging the latest advanced-node technology, were developed to meet these product requirements. Increasingly these challenges are being met by moving beyond single IC solutions. Today’s electronic systems often integra... » read more

The Gargantuan 5G Chip Challenge


Blazing fast upload and download speeds for cellular data are coming, but making the technology function as expected throughout its expected lifetime is an enormous challenge that will require substantial changes across the entire chip ecosystem. While sub-6GHz is an evolutionary step from 4G LTE, the real promise of 5G kicks in with millimeter-wave (mmWave) technology. But these higher-freq... » read more

Power/Performance Bits: Nov. 8


Molecular memristor Researchers from National University of Singapore, Indian Association for the Cultivation of Science, University of Limerick, Texas A&M University, and Hewlett Packard Enterprise discovered a molecular memristor for brain-inspired computing. The molecule uses natural asymmetry in its metal-organic bonds to switch between different states, which allows it to perform u... » read more

RF/Microwave Technology Driving The Connected Car


In-car networks and advanced driver-assistance systems (ADAS), made possible through wireless sensors, driver-assist radar, vehicle communications, and related electronics, present many design challenges to engineers. Simulation software enables design teams to effectively manage the complex design and integration challenges associated with developing these high-speed and RF-enabled networks. T... » read more

System-In-Package Thrives In The Shadows


IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly under the radar because it adds a competitive edge. With a SiP, several chips and other components are integrated into a package, enabling it to function as an electronic system or sub-system. ... » read more

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