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Technical Paper Home

  • Step Towards 3D PICs: Low Loss Fiber-Coupled Interconnects (UIUC)

    Published on July 16, 2024
  • NVMs: In-Memory Fine-Grained Integrity Verification Technique (Intel Labs, IISc)

    Published on July 16, 2024
  • In Situ Backpropagation Strategy That Progressively Updates Neural Network Layers Directly in HW (TU Eindhoven)

    Published on July 16, 2024
  • Chip Industry Technical Paper Roundup: July 16

    Published on July 16, 2024
  • Research Bits: July 16

    Published on July 16, 2024
  • EDA Revenue Up, China Weak

    Published on July 15, 2024
  • Intel Vs. Samsung Vs. TSMC

    Published on July 15, 2024
  • Monolithic 3D TFT Integration at Room Temperature, Used to Stack 10 Vertical Layers

    Published on July 12, 2024
  • Chip Industry Week In Review

    Published on July 12, 2024
  • Changes In Formal Verification

    Published on July 11, 2024
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