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Technical Papers

• Design of strongly nonlinear graphene nanoelectromechanical systems in quantum regime

  Published on January 10, 2022

• Spin–orbit torque engineering in β-W/CoFeB heterostructures with W–Ta or W–V alloy layers between β-W and CoFeB

  Published on January 4, 2022

• Field-free spin-orbit torque-induced switching of perpendicular magnetization in a ferrimagnetic layer with a vertical composition gradient

  Published on January 4, 2022

• Conceptual Model of the Automated Pedestrian Simulation System for Unmanned Vehicles and ADAS Systems Testing

  Published on December 31, 2021

• Semiconductor nanochannels in metallic carbon nanotubes by thermomechanical chirality alteration

  Published on December 23, 2021

• TAP-2.5D: A Thermally-Aware Chiplet Placement Methodology for 2.5D Systems

  Published on December 23, 2021

• A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process

  Published on December 23, 2021

• Holistic Die-to-Die Interface Design Methodology for 2.5-D Multichip-Module Systems

  Published on December 23, 2021

• Research on the Humidity Resistance Reliability of Different Packaging Structures

  Published on December 23, 2021

• A review of interconnect materials used in emerging memory device packaging: first- and second-level interconnect materials

  Published on December 23, 2021
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