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Materials

• Surface-Activated ALD For Room-Temperature Bonding of Al2O3

  Published on April 3, 2023

• Using Photonic Band Gap in Triangular SiC Structures for Efficient Quantum Nanophotonic HW

  Published on April 3, 2023

• Large Area Process For Atomically Thin 2D Semiconductor, Using Scalable ALD

  Published on March 30, 2023

• Interconnects: Exploring Semi-Metals (Penn State, IBM, Rice University)

  Published on March 26, 2023

• Photonics: GaSb/SiN Tunable Hybrid Integrated Laser

  Published on March 24, 2023

• New Spintronics Manufacturing Process, Allowing Scaling Down To Sub-5nm (U. of Minnesota/NIST)

  Published on March 20, 2023

• Room-Temperature Metal Bonding Technology That Facilitates The Fabrication of 3D-ICs & 3D Integration With Heterogeneous Devices

  Published on March 19, 2023

• Shift Register-In-Memory Architecture

  Published on March 19, 2023

• Large-Scale Nanometer-Thick Graphite Film (NGF) As A EUV Pellicle

  Published on March 18, 2023

• Co-Design View of Cross-Bar Based Compute-In-Memory

  Published on March 15, 2023
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