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Technical Paper Home

  • New Approaches To Power Decoupling

    Published on October 24, 2024
  • Reduce Augmented Reality Device Time-to-Market by Bringing Manufacturing Impact to Optical Simulation

    Published on October 24, 2024
  • The Growing Imperative Of Hardware Security Assurance In IP And SoC Design

    Published on October 24, 2024
  • Overview Of The Current State of the Development Of Curvilinear Masks

    Published on October 24, 2024
  • Monolithic Vs. Heterogeneous Integration

    Published on October 24, 2024
  • Current and Emerging Heterogeneous Integration Technologies For High-Performance Systems (Georgia Tech)

    Published on October 23, 2024
  • Overview Of Security Verification Methodologies for SoC Designs Pre-Silicon (U. of Florida)

    Published on October 23, 2024
  • Characterizing Defects Inside Hexagonal Boron Nitride (KAIST, NYU, et al.)

    Published on October 23, 2024
  • New Approach to Encoding Optical Weights for In-Memory Photonic Computing Using Magneto-Optic Memory Cells

    Published on October 23, 2024
  • Americas Chip Funding Energizes Industry

    Published on October 23, 2024
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