eSilicon is an independent provider of complex FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. The company’s ASIC+IP synergies include complete 2.5D/HBM2 and TCAM platforms for FinFET technology at 16/14/7nm as well as SerDes, specialized memory compilers and I/O libraries.
Supported by patented knowledge base and optimization technology, the company serves the high-bandwidth networking, high-performance computing, artificial intelligence (AI) and 5G infrastructure markets.
Executive Insight: Jack Harding
eSilicon’s president and CEO talks about the rising cost of semiconductor development and what will change for the companies that no longer can afford to pay those costs.
