Tignis specializes in AI-powered process control for semiconductor manufacturing. Its technology can be deployed directly on semiconductor fabrication equipment from OEMs and layered on top of existing manufacturing processes, providing the ability to find and investigate problems with production and simulate manufacturing processes.
Its PAICe Maker product enables a range of capability enhancements on a per-wafer or continuous basis, including deposition optimization, etching optimization, bow and warp reduction, computational metrology, and process drift/recipe tuning.
Its PAICe Monitor product can identify complex and non-linear multivariate relationships between process variables and target metrics, automatically generate analytics to monitor for complex process deviations, and prevent future occurrences.
