Test, metrology data for dynamic process control; known good interposers; leading-edge DFT; graduates’ path in manufacturing and test; organic, glass substrates; lowering AI barriers; test standards.
Edge/IoT security improving; software-defined vehicle impacts; ISO 26262 spreads to new markets; threat assessment questions; GPUs in auto; Matter 1.4; early issue identification.
Special report on precision needs for advanced packaging; NAND flash targets 1,000 layers; 3D DRAM; GaN and SiC; laser ablation; GAA TCAD simulation; AI in manufacturing and packaging; interconnect technologies; heterogeneous integration.
In-memory compute; chiplet interconnect issues; software for shift left; aging and complexity in analog design; connecting AI/HPC chips; PCle and CXL; reset tree design; testing chiplets; NPUs; dual-grid interpolation; radar development; AI for games; GenAI at scale; SRAM; art of simulation.
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