Special report on auto driving IC security; mil/aero mission engineering; chip aging cyber threats; changes in motor control; GPU vs. ASIC for LLMs; edge AI, GenAI; custom RoT; companion MCUs for SDVs; auto GPUs.
Special report on first-time silicon falloff; chiplet resources, architectures; digital twins, AI for verification; verification experts vs. generalists; AI's role in verification grows; scenario coverage in formal verification; optimizing data movement; EDA's changing times; photonic simulation; 6G; SoC wire lengths.
Special report on thin wafer processing; defining chiplets, heterogeneous integration; challenges grow for medical ICs; weighing EUV photoresist options; interfacial delamination; AI models for fab.
3D-ICs for the masses; chiplet power issues; more data to optimize chips; design and generative AI; faster debug; MIPI in auto; drive strength; GNNs; ADAS porting issues; object detection.
Automation and AI improve failure analysis; cutting IC manufacturing costs by mixing financial data with fab analytics; fundamental changes needed in failure analysis to keep pace with changes in chip technology.
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