Siemens EDA, is seeking a senior level, self-starting, motivated, and hard working individual for an opportunity to serve as a chiplet design lead in our 3D IC Solutions Engineering team in driving the development of comprehensive, end to end workflow solutions supporting the development of advanced 2.5 and 3D System in Package (SIP) designs. These multi-domain workflow solutions seamlessly integrate Siemens’ industry leading EDA and MCAD tools that facilitate the architectural planning, physical design/verification, muti-die based electrical, thermal, mechanical stress analysis and manufacturing test of advanced 2.5 and 3D System-in-Package (SIP) designs.

The primary responsibility for this position is in developing scripts and workflows to support the planning, integration and verification of chiplet IC designs into a 2.5/3D IC package designs. An additional responsibility is to work with the 3D IC Solutions package design lead and place and route engineering team to develop an integrated silicon interposer physical design and verification flow. Additional responsibilities include providing technical support in the development and integration of design/reliability analysis workflows including IR Drop, Electromigration Analysis (EM), package and silicon interface level Timing Analysis & Signal Integrity Analysis.

Reference designs and test structures and/or customer designs will be used in the development, testing and validation of these workflows. The chiplet design lead will also provide technical support and guidance to the sales, marketing design service organizations as required.



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